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Lau Boon Long
Institutions:
Agency for Science, Technology and Research,
Institute of Microelectronics
Observed institutions:
Agency for Science, Technology and Research,
Singapore Science Park,
Institute of Microelectronics,
Institute of Microelectronics
OpenAlex ID:
A5020015355
A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres
2023
·
Sajay Bhuvanendran Nair Gourikutty
, Lau Boon Long
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
25
Double Mold Antenna in Package for 77 GHz Automotive Radar
2020
·
Soon Wee Ho
, Soh Siew Boon
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
15
A Compact Wafer-Level Heterogeneously Integrated Scalable Optical Transceiver for Data Centers
2024
·
Sajay Bhuvanendran Nair Gourikutty
, Jiaqi Wu
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
11
Ka-Band AiP Array in Mold-on-Mold FOWLP technology
2022
·
Sun Mei
, Lim Teck Guan
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
8
1.6 Tbps (224 Gbps/λ) Silicon Photonic Engine Fabricated with Advanced Electronic-Photonic FOWLP for Co-Packaged Optics and Linear Drive Applications
2024
·
Xin Li
, Sajay B. N. Gourikutty
, et al.
·
Optical Fiber Communication Conference
·
7
3D Stacking of Heterogeneous Chiplets on Modified FOWLP Platform with Thru-Silicon Redistribution Layer
2023
·
Chai Tai Chong
, Lau Boon Long
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
6
Design and Optimization of Wafer-Level Compression Molding Process for One Chip Plus Multiple Decaps
2015
·
Lin Bu
, Siowling Ho
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
6
Novel Selective Metal Capping on Cu pad Enabling Void-Free Hybrid Bonding at Low Thermal Budgets, Irrespective of Cu Topography and Microstructure
2025
·
Hemanth Kumar Cheemalamarri
, Masahisa Fujino
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
4
Direct-Drive 224 Gbps/λ PAM4 and 112 Gbps/λ NRZ Silicon Photonic Transmitter Enabled by FOWLP Electronic-Photonic Integration
2024
·
Xin Li
, Sajay Bhuvanendran Nair Gourikutty
, et al.
·
IEEE Silicon Photonics Conference (SiPhotonics)
·
2
Wafer Level Fabrication of Embedded Silicon Microcooler on Heating Devices
2023
·
Lau Boon Long
, Javier Ong
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
2
Development of Two-Tier FO-WLP AiPs for Automotive Radar Application
2022
·
Soon Wee Ho
, Hsiao Hsiang-Yao
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
2
Fabrication Process Flow of Antenna-in-Package Fan-out Wafer Level Packaging
2021
·
Lau Boon Long
, David Ho
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
2
RDL Process Development of MEMS Wafer Level Chip Scale Packaging with Silicon Pillar/CuPd as Through Mold Interconnection
2018
·
Lau Boon Long
, Chen Zhaohui
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
2
Thermo-mechanical design of fan-out wafer level package for power converter module
2017
·
Zhaohui Chen
, Tang Gongyue
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
2
Development of Large RDL Interposer Package: RDL-first FOWLP and 2.5D FO-Interposer
2024
·
Soon Wee Ho
, Soh Siew Boon
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
1
Silicon Interposer Heterogenous Integration Platform for Millimeter-Wave Ka and V Band Satellite Applications
2024
·
Sun Mei
, Javier Ong Jun Wei
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
1
Wafer Level Fabrication of Embedded Liquid Cooling Solutions on Heating Devices with TSV Interconnects
2024
·
Lau Boon Long
, Javier Ong
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
1
Optimization of High Aspect Ratio Copper Pillar Fabrication for Through Mold Interposer (TMI) Processing
2024
·
Peh Cun Jue
, Lau Boon Long
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
Wafer Level Package with Polymer Sealed Air Cavity
2022
·
Soon Wee Ho
, Serine Soh Siew Boon
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
Double Mold Fan-Out Wafer Level Packaging for AiP Applications
2022
·
Lau Boon Long
, David Ho
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
RF Performance of FOWLP to PCB Board Transition
2022
·
Kai Bo Zheng
, Sun Mei
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
A Study to Reduce Molding Film Defects During Vacuum Lamination Process
2020
·
Lau Boon Long
, David Ho
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
Fowlpのボードレベルはんだ接合信頼性設計と解析【jst・京大機械翻訳】
2020
·
Zhang Xiaowu
, Lau Boon Long
, et al.
·
IEEE Conference Proceedings
Si-based Hybrid Micro-cooler Fabrication Process Development
2019
·
Lau Boon Long
, Han Yong
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
高熱流束冷却のための多重排水微細溝を持ったSiベースのハイブリッド超小型冷却器【Powered by NICT】
2017
·
Han Yong
, Lau Boon Long
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
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Works count:
27
Citation count:
97
H-index:
6
I10-index:
3
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