Author

Martin Eibelhuber

Observed names: Eibelhuber, Martin, M. Eibelhuber, Martin EIBELHUBER
OpenAlex ID: A5020454435
2014 · Rainer T. Lechner, Gerhard Fritz-Popovski, et al. · Chemistry of Materials · 52
2021 · Christine Thanner, Martin Eibelhuber · Nanomaterials · 45
2011 · A. Hochreiner, T. Schwarzl, et al. · Applied Physics Letters · 44
2018 · Thomas Uhrmann, Jurgen Burggraf, et al. · International Wafer Level Packaging Conference (IWLPC) · 26
2020 · Christine Thanner, Anna Dudus, et al. · Optical Architectures for Displays and Sensing in Augmented, Virtual, and Mixed Reality (AR, VR, MR) · 17
2009 · M. Eibelhuber, T. Schwarzl, et al. · Applied Physics Letters · 17
2017 · Hubert Teyssedre, Stefan Landis, et al. · Advanced Optical Technologies · 15
2014 · A. Khiar, V. Volobuev, et al. · Applied Physics Letters · 11
2010 · H. Pühringer, J. Roither, et al. · Applied Physics Letters · 8
2019 · Claudia Lenk, Yana Krivoshapkina, et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · 6
2016 · H. Teyssedre, S. Landis, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 5
2020 · Saeedeh Ravandi, Cezarina Cela Mardare, et al. · Thin Solid Films · 4
2010 · M. Eibelhuber, T. Schwarzl, et al. · Journal of Crystal Growth · 4
2021 · Martin Eibelhuber, Christine Thanner, et al. · Optical Architectures for Displays and Sensing in Augmented, Virtual, and Mixed Reality (AR, VR, MR) · 3
2018 · M. Eibelhuber, J. Rimbock, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 3
2017 · H. Teyssedre, S. Landis, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3
2022 · Jérôme Rêche, Maxime Argoud, et al. · SPIE Novel Patterning Technologies · 2
2021 · Jérôme Rêche, Maxime Argoud, et al. · SPIE Novel Patterning Technologies · 2
2019 · Saeedeh Ravandi, Tobias Zenger, et al. · physica status solidi (a) · 2
2017 · T. Uhrmann, Elisabeth Brandl, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 2
Works count: 39
Citation count: 345
H-index: 10
I10-index: 12
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