Author

Dan J. Lim

Observed name: D. Lim

Observed institution: Université des Sciences et de la Technologie d'Oran Mohamed Boudiaf

OpenAlex ID: A5020777939

A three‐dimensional transmission line matrix (TLM) simulation method for thermal effects in high power insulated gate bipolar transistors

2003 · R. Hocine, D. Lim, et al. · Circuit World · 2

Characterization of thermal dissipation within integrated gate bipolar transistor (IGBT) layered packaging structure

2008 · Dan J. Lim · Repository@Hull (Worktribe) (University of Hull)

Works count: 2

Citation count: 2

H-index: 1

I10-index: