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Jen-Chieh Kao

Observed name: Jen Chieh Kao
OpenAlex ID: A5020902302
A Study on the Surface Activation of Plasma Treatment for Hybrid Bonding Joint Interface
2024 · Chih-Jing Hsu, Hsu-Nan Fang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 8
60-GHz SiGe BiCMOS dual-conversion down-converter: Schottky diode RF mixer and analog Gilbert IF mixer with microwave quadrature generator
2016 · Jen-Chieh Kao, Chinchun Meng, et al. · IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) · 4
Micro-bump bondability design guidelines for high throughput 2.5D & 3D IC assemblies
2013 · Chang-Lin Yeh, Yung-Yi Yeh, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 3
High Accuracy Selective Patterning for EMI Shielding of 5G AiP
2024 · Ming-Hung Chen, Huei-Pin Jian, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
Demonstration of flexible encapsulation in assembly industry
2022 · Chao-Wei Liu, Ming-Hung Chen, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
V-band dual-conversion down-converter with Schottky-diode ring-mixer using 0.35μm SiGe BiCMOS process
2015 · Jen-Chieh Kao, Chinchun Meng, et al. · Asia-Pacific Microwave Conference (APMC) · 2
Yield-Limiting Mechanisms Governed by Dicing and Bonding Conditions in Organic Hybrid Bonding
2026 · Zhao-Ze Jiang, Alexis Angelo R. Garcia, et al. · International Conference on Electronics Packaging (ICEP) · 1
Patch-type Flex SiP Platform for Heathcare Application
2023 · Ming-Hung Chen, Wei-Hao Chang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 1
Heterogeneous Substrate and its Characterization for 5G mmWave Antenna in Package
2021 · Wei-Tung Chang, Shao-En Hsu, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 1
DSM Reballing Ball Height Prediction Model
2020 · Chao-Wei Liu, Shang-Lin Wu, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 1
Characterization of Bonding Behavior and Void Formation in Chip-on-Wafer Hybrid Bonding
2026 · Zhao-Ze Jiang, Chih-Jing Hsu, et al. · IEEE Electronic Components and Technology Conference (ECTC)
Pressure-less Cu/Polymer Hybrid Bonding at Low Temperature and Fine Pitch using a Novel Polymer Adhesive with Precisely Controlled Composition
2026 · Ryo Hayakawa, Yuzo Nakamura, et al. · IEEE Electronic Components and Technology Conference (ECTC)
High-efficiency Cleaning for Particle Removal Applied in the CoW Hybrid Bonding Process
2026 · Chih-Jing Hsu, Zhao-Ze Jiang, et al. · International Conference on Electronics Packaging (ICEP)
A High Gain Antenna-in-Package (AiP) with Horn Structure for D-Band Applications
2025 · Po-An Lin, Shao-En Hsu, et al. · European Microelectronics and Packaging Conference
Development Fine Pitch Organic Hybrid Bonding Application
2025 · Chih-Jing Hsu, Che-Ming Hsu, et al. · International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
Flexible Hybrid Electronics on Wearable Healthcare Application
2024 · Ming-Hung Chen, Wei-Hao Chang, et al. · IMAPSource Proceedings
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Flexible Hybrid Electronics on Wearable Healthcare Application
2023 · Ming-Hung Chen, Wei-Hao Chang, et al. · European Microelectronics and Packaging Conference
損耗電感對於單頻帶/雙頻帶/寬頻帶SiGe HBT低雜訊放大器之效應
2016 · 高仁傑, 孟慶宗, et al.
Works count: 18
Citation count: 25
H-index: 3
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