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Stoyan Stoyanov

Observed names: S Stoyanov, S. Stoyanov, Stoyanov, S., Stoyanov, Stoyan, Stoyanov, Stoyan K.
ORCID: 0000-0001-6091-1226
Observed ORCID: 0000-0001-6091-1226
OpenAlex ID: A5020951904
Prognostic and health management for engineering systems: a review of the data‐driven approach and algorithms
2015 · Thamo Sutharssan, Stoyan Stoyanov, et al. · The Journal of Engineering · 123
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The role of microstructure in the thermal fatigue of solder joints
2024 · J. W. Xian, Y. L. Xu, et al. · Nature Communications · 86
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A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints
2022 · Yilun Xu, Jingwei Xian, et al. · International Journal of Plasticity · 77
Design, manufacture and test for reliable 3D printed electronics packaging
2018 · Tim Tilford, Stoyan Stoyanov, et al. · Microelectronics Reliability · 46
A review of data-driven prognostics in power electronics
2012 · Ahsanul Kabir, Christopher Bailey, et al. · International Spring Seminar on Electronics Technology · 41
Prognostics and Health Monitoring of High Power LED
2012 · Thamo Sutharssan, Stoyan Stoyanov, et al. · Micromachines · 41
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Machine learning for additive manufacturing of electronics
2017 · Stoyan Stoyanov, Chris Bailey · International Spring Seminar on Electronics Technology · 33
Data driven prognostics for predicting remaining useful life of IGBT
2016 · Mominul Ahsan, Stoyan Stoyanov, et al. · International Spring Seminar on Electronics Technology · 32
Optimisation modelling for thermal fatigue reliability of lead‐free interconnects in fine‐pitch flip‐chip packaging
2009 · Stoyan Stoyanov, Chris Bailey, et al. · Soldering and Surface Mount Technology · 32
A Critical Review on Battery Aging and State Estimation Technologies of Lithium-Ion Batteries: Prospects and Issues
2023 · Probir Kumar Roy, Mohammad Shahjalal, et al. · Electronics · 30
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Data driven approach to quality assessment of 3D printed electronic products
2015 · Georgios Tourloukis, Stoyan Stoyanov, et al. · International Spring Seminar on Electronics Technology · 28
3D-printing and electronic packaging
2016 · C Bailey, S Stoyanov, et al. · Pan Pacific Symposium · 23
Predictive analytics methodology for smart qualification testing of electronic components
2019 · Stoyan Stoyanov, Mominul Ahsan, et al. · Journal of Intelligent Manufacturing · 22
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Comparative Reliability of Inkjet-Printed Electronics Packaging
2021 · Tim Tilford, Stoyan Stoyanov, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 21
Fine-grained food image classification and recipe extraction using a customized deep neural network and NLP
2024 · Razia Sulthana Abdul Kareem, Timothy Tilford, et al. · Computers in Biology and Medicine · 20
Optimisation modelling for flip‐chip solder joint reliability
2002 · S. Stoyanov, C. Bailey, et al. · Soldering and Surface Mount Technology · 20
Prognostics of automotive electronics with data driven approach: A review
2016 · Mominul Ahsan, Stoyan Stoyanov, et al. · International Spring Seminar on Electronics Technology · 18
Modelling and prototyping the conceptual design of 3D CMM micro-probe
2008 · S. Stoyanov, C. Bailey, et al. · Electronic System-Integration Technology Conference (ESTC) · 17
Thermo-mechanical sub-modelling of BGA components in PCB reflow
2013 · Stoyan Stoyanov, Alexander Dabek, et al. · International Spring Seminar on Electronics Technology · 16
Coupled thermal-mechanical analysis of power electronic modules with finite element method and parametric model order reduction
2024 · Sheikh Hassan, Pushparajah Rajaguru, et al. · Power Electronic Devices and Components · 15
Modelling methodology for thermal analysis of hot solder dip process
2013 · Stoyan Stoyanov, Chris Bailey, et al. · Microelectronics Reliability · 15
Deep Learning Modelling for Composite Properties of PCB Conductive Layers
2022 · Stoyan Stoyanov, Chris Bailey · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 14
No-flow underfill flip chip assembly––an experimental and modeling analysis
2002 · H Lu, K.C Hung, et al. · Microelectronics Reliability · 14
Reliability Impact of Assembly Materials for Micro-BGA Components in High Reliability Applications
2020 · Stoyan Stoyanov, Chris Bailey, et al. · Electronic System-Integration Technology Conference (ESTC) · 13
Similarity approach for reducing qualification tests of electronic components
2016 · Stoyan Stoyanov, Chris Bailey, et al. · Microelectronics Reliability · 13
Works count: 157
Citation count: 1,196
H-index: 17
I10-index: 32
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