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Author

Dewen Zhao

Observed names: D. Zhao, D.P. Zhao, DeWen Zhao, Dewen ZHAO
Observed institutions: Harbin Engineering University, Shandong University, Lam Research (United States), State Key Laboratory of Tribology, University of Edinburgh, Tsinghua University
ORCID: 0000-0002-7622-9296
Observed ORCID: 0000-0002-7622-9296
OpenAlex ID: A5021955006
Chemical mechanical polishing: Theory and experiment
2013 · Dewen Zhao, Xinchun Lu · Friction · 256
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The material removal and surface generation mechanism in ultra-precision grinding of silicon wafers
2022 · Hongfei Tao, Yuanhang Liu, et al. · International Journal of Mechanical Sciences · 62
Prediction and measurement for grinding force in wafer self-rotational grinding
2023 · Hongfei Tao, Yuanhang Liu, et al. · International Journal of Mechanical Sciences · 58
Ductile deformation and subsurface damage evolution mechanism of silicon wafer induced by ultra-precision grinding process
2023 · Hongfei Tao, Yuanhang Liu, et al. · Tribology International · 54
Fabrication of Flexible and Transparent Metal Mesh Electrodes Using Surface Energy‐Directed Assembly Process for Touch Screen Panels and Heaters
2023 · Siqing Yuan, Zebin Fan, et al. · Advanced Science · 44
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Effects of grinding-induced surface topography on the material removal mechanism of silicon chemical mechanical polishing
2023 · Hongfei Tao, Qinyang Zeng, et al. · Applied Surface Science · 42
Undeformed chip width non-uniformity modeling and surface roughness prediction in wafer self-rotational grinding process
2022 · Hongfei Tao, Yuanhang Liu, et al. · Tribology International · 41
Kinematic Optimization for Chemical Mechanical Polishing Based On Statistical Analysis of Particle Trajectories
2013 · Dewen Zhao, Tongqing Wang, et al. · IEEE Transactions on Semiconductor Manufacturing · 41
In-situ measurement of Cu film thickness during the CMP process by using eddy current method alone
2013 · Zilian Qu, Qian Zhao, et al. · Microelectronic Engineering · 40
Cutting speed dependence of material removal mechanism for monocrystal silicon
2023 · Hongfei Tao, Yuanhang Liu, et al. · International Journal of Mechanical Sciences · 37
Influence of anisotropy on material removal and deformation mechanism based on nanoscratch tests of monocrystal silicon
2023 · Hongfei Tao, Qinyang Zeng, et al. · Tribology International · 36
Anchoring Ni atomic clusters on yolk-shell In2O3 microspheres for highly sensitive, ultra-rapid responding/recovering ppb-level NO2 detections
2024 · Zhidong Jin, Yue Mou, et al. · Chemical Engineering Journal · 29
Effects of wheel spindle vibration on surface formation in wafer self-rotational grinding process
2022 · Hongfei Tao, Yuanhang Liu, et al. · International Journal of Mechanical Sciences · 29
An Investigation on the Total Thickness Variation Control and Optimization in the Wafer Backside Grinding Process
2022 · Yuanhang Liu, Hongfei Tao, et al. · Materials · 26
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Flatness maintenance and roughness reduction of silicon mirror in chemical mechanical polishing process
2019 · BoCheng Jiang, DeWen Zhao, et al. · Science China Technological Sciences · 26
Effect of zone pressure on wafer bending and fluid lubrication behavior during multi-zone CMP process
2013 · Dewen Zhao, Tongqing Wang, et al. · Microelectronic Engineering · 26
Effect of Kinematic Parameters and Their Coupling Relationships on Global Uniformity of Chemical-Mechanical Polishing
2012 · Dewen Zhao, Yongyong He, et al. · IEEE Transactions on Semiconductor Manufacturing · 26
Strategies of realizing NO2 detections with enhanced selectivity and anti-humidity based on snowflake-like in-situ grown ZIF-8/ZnOHF composites
2024 · Zhidong Jin, Jinbo Zhao, et al. · Sensors and Actuators B Chemical · 24
Humidity-independent NO2 gas sensors based on ZnO-NiOFx nanocomposites and the synergistic humidity-immune effect of fluorine doped NiO
2024 · Zhidong Jin, Yue Mou, et al. · Journal of Power Sources · 23
Numerical investigation of wafer drying induced by the thermal Marangoni effect
2018 · Changkun Li, Dewen Zhao, et al. · International Journal of Heat and Mass Transfer · 22
Evolution of entrained water film thickness and dynamics of Marangoni flow in Marangoni drying
2018 · Changkun Li, Dewen Zhao, et al. · RSC Advances · 20
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Optimization of design of experiment for chemical mechanical polishing of a 12-inch wafer
2013 · Tongqing Wang, Xinchun Lu, et al. · Microelectronic Engineering · 20
Process Control in Semiconductor Manufacturing Based on Deep Distributional Soft Actor-Critic Reinforcement Learning
2025 · Bangxu Liu, Dewen Zhao, et al. · IEEE Transactions on Semiconductor Manufacturing · 18
Effect of slurry injection position on material removal in chemical mechanical planarization
2013 · Tongqing Wang, Dewen Zhao, et al. · The International Journal of Advanced Manufacturing Technology · 18
Assessment of Physics-Based and Data-Driven Models for Material Removal Rate Prediction in Chemical Mechanical Polishing
2018 · Xuan Li, Cheng Wang, et al. · 16
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Works count: 70
Citation count: 1,299
H-index: 20
I10-index: 36
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