2020 · Gautier Girard, Marion Martiny, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 5

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Numerical study of the thermomechanical response of printed circuit boards with embedded flip-chips

2026 · Paul Perin, Gautier Girard, et al. · Microelectronics Reliability · 2

Microvia Homogenised Behaviour for the Mechanical Modelling of PCB with Embedded Components

2025 · Flora Dailland, Gautier Girard, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 1

Analysis of the peel test for elastic-plastic film with combined kinematic and isotropic hardening

2021 · G. Girard, M. Martiny, et al. · International Journal of Fracture · 1

Caractérisations expérimentale et numérique de composites minces tramés utilisés dans les circuits imprimés pour des applications hyperfréquences

2017 · Gautier Girard, Mohamad Jrad, et al. · 1

Inverse identification of process-induced shrinkage strain for a B-stage thermoset resin in woven pre-impregnated lamina via warpage analysis

2026 · Mickaël Leicht, Gautier Girard, et al. · Composites Part A Applied Science and Manufacturing

Thermal shock simulations of a PCB with embedded components and microvia based interconnection: meso-scale modeling of the woven composite

2026 · M. Leicht, B. Arati, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Towards a new methodology to characterize the fracture energies of the woven composite/copper interface in mode I and mode II: Application to printed circuit boards

2025 · Charaf-Eddine Ziouani, Gautier Girard, et al. · Engineering Fracture Mechanics

Étude de l’impact des variations d’épaisseur d’un composite tissé sur les propriétés mécaniques

2025 · Leicht, Mickaël, Girard, Gautier, et al. · HAL

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Caractérisation et modélisation thermomécaniques de matériaux et de structures circuits imprimés complexes destinés aux applications spatiales radiofréquences et micro-ondes

2018 · Gautier Girard · theses.fr (ABES)

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Characterization of Thin Woven Composites Used in Printed Circuit Boards by Combining Numerical and Experimental Approaches

2018 · Gautier Girard, M. Martiny, et al. · World Academy of Science, Engineering and Technology, International Journal of Architectural and Environmental Engineering

Works count: 19

Citation count: 103

H-index: 5

I10-index: 4