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Jeff Calvert

Observed names: J Calvert, J. Calvert
OpenAlex ID: A5022018823
JWST mirror production status
2011 · Benjamin Gallagher, Mark Bergeland, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 15
Dependence of the minimal PVD TA(N) sealing thickness on the porosity of Zirkon™ LK dielectric films
2002 · F Iacopi, C Zistl, et al. · Microelectronic Engineering · 15
Photopatternable Laminate BCB Dielectric
2014 · Corey O'Connor, Robert Barr, et al. · IMAPSource Proceedings · 6
Thin Wafer Handling Using Mechanical- or Laser-Debondable Temporary Adhesives
2015 · David Fleming, Jong-Uk Kim, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 4
Future Interconnect Materials and System Integration Strategies for Data-Intensive Applications
2018 · Pushkar Apte, Suresh Ramalingam, et al. · Electronic System-Integration Technology Conference (ESTC) · 3
Comparison of modulus and density measurements by nanoidentation, SAWS, XRR and EP techniques of a porous low k MSQ dielectric
2005 · Thomas Abell, Francesca Iacopi, et al. · 2
System-level Trade-offs and Optimization for Data-Driven Applications
2018 · Pushkar Apte, Tom Salmon, et al. · IMAPSource Proceedings · 1
Evaluation of High-Speed Copper Plating Products for RDL, Micropillar, and Fan-Out Applications
2016 · Matthew A Thorseth, Mark Scalisi, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 1
Cu electroplating chemistry and process enabling rapid TSV filling with long bath life
2015 · Matthew A Thorseth, Luis Gomez, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 1
Self Priming Low Stress Aqueous Developable Benzocyclobutene (AD-BCB) Photodielectric Materials for Advanced Wafer Level Packaging
2015 · Hua Dong, Greg Prokopowicz, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 1
Copper, Nickel, and Lead-Free Solder Electroplating Solutions for Pillar and Micro-Pillar Capping Applications
2013 · Julia Woertink, Erik Reddington, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 1
Integration of Chemically Amplified Photoresist and High-Speed Copper Plating Products for Advanced Packaging Applications
2017 · Rosemary Bell, Joseph Lachowski, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
Laser Direct Patterning of Dry Etch BCB Adhesive Layers for Low Temperature Permanent Wafer-to-Wafer Bonding
2016 · Kai Zoschke, J.-U. Kim, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
Design and manufacturing considerations for 0.25-1.5 meter beryllium telescopes for current and future space missions
2015 · Mike Sweeney, Mark Warren, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
Versatile Lead-Free Solder Electroplating Products for Advanced Bumping Technologies
2014 · Inho Lee, Regina Cho, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
Conference report Materials Research Society Symposium
1997 · Jeff Calvert · Supramolecular Science
Works count: 16
Citation count: 50
H-index: 4
I10-index: 2
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