Author

Tianran Ding

Observed name: Ding, Tianran

Institution: Zhengzhou Institute of Machinery

Observed institutions: Harbin Institute of Technology, Zhengzhou Institute of Machinery, State Key Laboratory of Advanced Brazing Filler Metals and Technology, State Key Laboratory of Advanced Welding and Joining, Centre de recherche public Henri-Tudor

ORCID: 0009-0001-8558-5276

Observed ORCID: 0009-0001-8558-5276

OpenAlex ID: A5024511931

Low-temperature lead-free SnBiIn solder for electronic packaging

2024 · Shannan Zhang, Weimin Long, et al. · Journal of Materials Science Materials in Electronics · 24

Investigation of isothermal aged Sn-3Ag-0.5Cu/Sn58Bi-Co hybrid solder joints on ENIG and ENEPIG substrate with various mechanical performances

2024 · Shuai Zhang, Qingyang Qiu, et al. · Materials Today Communications · 11

Impact of embedded susceptor mass and exposure time on morphological and property alterations in SAC305 joints using microwave hybrid heating

2023 · Shuai Zhang, Hongzhi Zhou, et al. · Materials Letters · 8

Microwave hybrid joining of SAC305-Ni@Sn composite solder: Heating mechanism, mechanical reliability, and first-principles calculation

2025 · Shuai Zhang, Jinhong Liu, et al. · Materials Science and Engineering A · 7

High-performance soldering achieved through an energy-efficient magnetic field-assisted microwave hybrid joining: A multiscale study via molecular dynamics and first-principles calculations

2026 · Shuai Zhang, Chen Zeng, et al. · Materials Science and Engineering A · 4

Research progress on high thermal conductivity Cu/diamond composites and interfacial bonding

2026 · Shannan Zhang, Tao Wang, et al. · Welding in the World · 3

Microwave hybrid joining using SAC305-xNi@Sn solder paste to achieve superior performance and high-efficiency heating and unveiling cross-scale mechanisms

2025 · Shuai Zhang, Chen Zeng, et al. · International Journal of Thermal Sciences · 2

A review of heating mechanisms, process parameters, and defect-minimized densification applications of microwave sintering in metals

2026 · Qingyang Qiu, Yuntao Sun, et al. · Advanced Materials Joining · 1

Microstructural evolution, dynamic atomic transport, and electromigration suppression in CF@Ni-reinforced SAC305 composite joints during microwave hybrid joining

2026 · Shuai Zhang, Su Huang, et al. · Materials Characterization

Fully dynamic carbon footprint of circular biobased systems – A framework with temporal life cycle inventory database (DyPLCA) tailored for forestry and wood products cascades

2024 · Schaubroeck, Thomas, Gibon, Thomas, et al. · HAL

Works count: 10

Citation count: 60

H-index: 4

I10-index: 2