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Viktor Dudash

Observed name: V. Dudash
ORCID: 0009-0003-7617-6790
Observed ORCID: 0009-0003-7617-6790
OpenAlex ID: A5024549607
Temperature-dependent Creep Characterization of Lead-free Solder Alloys Using Nanoindentation for Finite Element Modeling
2023 · Viktor Dudash, Kashi Vishwanath Machani, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 5
Wafer Level Chip Scale Package Failure Mode Prediction using Finite Element Modeling
2023 · Viktor Dudash, Kashi Vishwanath Machani, et al. · IEEE International Reliability Physics Symposium proceedings · 5
Characterization and Modeling of Solder Interconnects for Wafer Level Packaging Applications Subjected to Low Cycle Fatigue Stress
2025 · V. Dudash, K. V. Machani, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2
Creep characterization of lead-free solder alloys over an extended temperature range used for fatigue modeling
2024 · Viktor Dudash, Kashi Vishwanath Machani, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 2
Design of Reliability Test Assemblies for WLCSP Solder Interconnects using Finite Element Modeling
2022 · Viktor Dudash, Karsten Meier, et al. · International Spring Seminar on Electronics Technology · 2
Works count: 5
Citation count: 16
H-index: 2
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