Author

Alexander May

Observed names: A. May, May, Alexander
ORCID: 0000-0001-8714-5840
Observed ORCID: 0000-0001-8714-5840
OpenAlex ID: A5024678954
2019 · Hyoungwon Park, Alexander May, et al. · Nature Sustainability · 136
2021 · Joost Romijn, Sten Vollebregt, et al. · IEEE Transactions on Electron Devices · 62
2023 · Jiarui Mo, Jinglin Li, et al. · IEEE Electron Device Letters · 44
2022 · Joost Romijn, Sten Vollebregt, et al. · Microsystems & Nanoengineering · 44
2024 · Alexander May, Mathias Rommel, et al. · Smart Systems Integration Conference and Exhibition (SSI) · 19
2023 · Nicola Rinaldi, Rosalba Liguori, et al. · Sensors · 14
2024 · Jiarui Mo, Yunfan Niu, et al. · Applied Physics Letters · 13
2023 · Alexander May, Mathias Rommel, et al. · Key engineering materials · 13
2024 · Nicola Rinaldi, Alexander May, et al. · IEEE Electron Device Letters · 11
2024 · Jiarui Mo, Jinglin Li, et al. · IEEE Transactions on Electron Devices · 11
2021 · Joost Romijn, Luke M. Middelburg, et al. · Proceedings of IEEE Sensors/Proceedings of IEEE Sensors ... · 11
2022 · Joost Romijn, Sten Vollebregt, et al. · IEEE International Conference on Micro Electro Mechanical Systems (MEMS) · 9
2024 · Nicola Rinaldi, Alexander May, et al. · IEEE Electron Device Letters · 7
2022 · Alexander May, Mathias Rommel, et al. · Materials science forum · 7
2025 · Nicola Rinaldi, Mathias Rommel, et al. · IEEE Sensors Letters · 6
2024 · Mathias Rommel, Alexander May, et al. · Journal of Microelectronics and Electronic Packaging · 4
2024 · Alexander May, Leander Baier, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 4
2024 · Jinglin Li, Sten Vollebregt, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 4
2023 · Michael Schraml, Niklas Papathanasiou, et al. · Key engineering materials · 3
2024 · Felipe Torres, Andrés Martínez, et al. · Argentine Conference on Electronics (CAE) · 2
2023 · M. Schraml, N. Papathanasiou, et al. · IEEE Photonics Conference · 2
2023 · Yaqian Zhang, Jiarui Mo, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2
Works count: 43
Citation count: 454
H-index: 11
I10-index: 12
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