Author

Hyungmin Kang

2017 · Hyungmin Kang, Yingmei Jin, et al. · International Journal of Aeronautical and Space Sciences · 47
2021 · Daehwan Lho, Hyunwook Park, et al. · IEEE Transactions on Electromagnetic Compatibility · 39
2010 · Hyung-Min Kang, Kyu Hong Kim, et al. · Journal of Computational Physics · 23
2018 · Daehwan Lho, Junyong Park, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 22
2011 · Sangwon Hong, Saeil Lee, et al. · Journal of Mechanical Science and Technology · 20
2019 · Daehwan Lho, Junyong Park, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 17
2006 · Hyungmin Kang, Joonwon Kim · IEEE International Conference on Micro Electro Mechanical Systems (MEMS) · 15
2020 · Hyunwook Park, Minsu Kim, et al. · IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) · 13
2003 · Hyungmin Kang, Dongho Lee, et al. · KSME International Journal · 12
2020 · Hyeokbin Kwon, Yingmei Jin, et al. · International Journal of Aeronautical and Space Sciences · 11
2011 · Sanghun Kim, Sangook Jun, et al. · Journal of Mechanical Science and Technology · 9
2010 · Sangook Jun, Kyung-Hyun Park, et al. · Journal of Mechanical Science and Technology · 9
2019 · Hyunwook Park, Junyong Park, et al. · IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) · 7
2023 · Hyunwook Park, Taein Shin, et al. · IEEE International Symposium on Electromagnetic Compatibility · 6
2020 · Boogyo Sim, Daehwan Lho, et al. · IEEE International Symposium on Electromagnetic Compatibility · 5
2020 · Subin Kim, Taein Shin, et al. · IEEE International Symposium on Electromagnetic Compatibility · 4
2014 · Hyungmin Kang, Kyunghyun Park, et al. · International Journal for Numerical Methods in Fluids · 4
2011 · Hyung-Min Kang, Cheol-Wan Kim, et al. · Journal of the Korean society for railway · 3
2021 · Hyunwook Park, Joonsang Park, et al. · IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) · 2
2019 · Hyungmin Kang, Subin Kim, et al. · IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) · 2
2023 · Boogyo Sim, Taein Shin, et al. · IEEE Wireless Power Technology Conference and Expo (WPTCE) · 1
Works count: 50
Citation count: 331
H-index: 11
I10-index: 11
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