Author

Zaifu Cui

2022 · Chao Wu, Xiaochuan Pan, et al. · IEEE Sensors Journal · 62
2021 · Zaifu Cui, Xin Li, et al. · Sensors and Actuators A Physical · 50
2022 · Zaifu Cui, Xin Li, et al. · Journal of the European Ceramic Society · 49
2022 · Lida Xu, Zaifu Cui, et al. · ACS Applied Materials & Interfaces · 42
2022 · Zaifu Cui, Guochun Chen, et al. · Journal of Alloys and Compounds · 27
2021 · Xin Li, Daoheng Sun, et al. · Sensors and Actuators A Physical · 23
2022 · Zaifu Cui, Xiaojun Chen, et al. · Sensors and Actuators A Physical · 18
2024 · Xiaojun Chen, Deyun Mo, et al. · Fibers and Polymers · 11
2023 · Xiaojun Chen, Yueyu Xu, et al. · AIP Advances · 10
2015 · Zaifu Cui, Miao Cai, et al. · Microelectronics Reliability · 10
2012 · Hongyu Tang, D.G. Yang, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 10
2011 · Daoguo Yang, Zaifu Cui · International Conference on Electronic Packaging Technology (ICEPT) · 9
2025 · Xiaojun Chen, Fang Wang, et al. · Materials Today Communications · 4
Works count: 36
Citation count: 668
H-index: 15
I10-index: 22
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