Get started
Author

Yoshihide Kihara

Observed names: Y Kihara, Y. Kihara, Yoshihide KIHARA
OpenAlex ID: A5025580084
Gas‐Grain Processes for the Formation of CH4and H2O: Reactions of H Atoms with C, O, and CO in the Solid Phase at 12 K
1998 · Kenzo Hiraoka, Takashi Miyagoshi, et al. · The Astrophysical Journal · 136
PDF
Benefits of atomic-level processing by quasi-ALE and ALD technique
2017 · M Honda, T Katsunuma, et al. · Journal of Physics D Applied Physics · 43
Pseudo‐Wet Plasma Mechanism Enabling High‐Throughput Dry Etching of SiO 2 by Cryogenic‐Assisted Surface Reactions
2024 · Shih‐Nan Hsiao, Makoto Sekine, et al. · Small Methods · 38
Beyond 10 μm Depth Ultra-High Speed Etch Process with 84% Lower Carbon Footprint for Memory Channel Hole of 3D NAND Flash over 400 Layers
2023 · Yoshihide Kihara, Maju Tomura, et al. · IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) · 35
Reaction of H Atoms with Solid C2H4and C2H6at 13 K
1999 · Kenzo Hiraoka, Kazuyosi Yamamoto, et al. · The Astrophysical Journal · 20
PDF
Novel technology of high-aspect-ratio etch utilizing coverage-controllable atomic layer deposition
2022 · Sho Kumakura, Hironari Sasagawa, et al. · Japanese Journal of Applied Physics · 19
PDF
Revolutionizing reactive ion etching: ion-enhanced surface autocatalytic reactions enabling ultra-high throughput using cryogenic hydrogen-fluoride plasma
2025 · Shih-Nan Hsiao, Yusuke Imai, et al. · Chemical Engineering Journal · 15
Reactions of Hydrogen Atoms with Solid, Thin Films of Acetone and 2‐Propanol at 13 K
1998 · Kenzo Hiraoka, Akihiro Yamashita, et al. · The Astrophysical Journal · 15
PDF
Unraveling etching mechanism for SiN film in cryogenic hydrogen-fluoride plasmas
2026 · Shih-Nan Hsiao, Yusuke Imai, et al. · Chemical Engineering Journal · 7
Cryogenic‐Assisted Hydrogen Fluoride Surface Reactions Enabling Reversibly Ultra‐High Selectivity of Atomic Layer Etching Between SiO 2 and SiN
2025 · Shih‐Nan Hsiao, Makoto Sekine, et al. · Small Methods · 7
PDF
Development for high-aspect-ratio hole etching with hydrogen fluoride gas based cryogenic process
2025 · Ryutaro Suda, Masahiko Yokoi, et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · 5
(Invited) Plasma-Enhanced Quasi-ALE and ALD Processing for Leading-Edge Microfabrication
2016 · Masanobu Honda, Takayuki Katsunuma, et al. · ECS Transactions · 3
PDF
Cryogenic etching characteristics of SiO2, SiN, and a-C films with HF/fluorocarbon-containing plasmas
2026 · Yusuke Imai, Shih-Nan Hsiao, et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1
New innovative etch technologies utilizing state-of-the-art atomic-level process for advanced patterning
2022 · Sho Kumakura, Takayuki Katsunuma, et al. · IEEE Electron Devices Technology & Manufacturing Conference (EDTM) · 1
Surface reactions and optical diagnostics of SiNx:H etching processes at cryogenic temperatures in CF4/H2 plasma mixtures
2026 · Michael K.T. Mo, N. Britun, et al. · Surfaces and Interfaces
PDF
Computational-aided etch process innovation
2025 · Yu-Hao Tsai, Du Zhang, et al. · Advanced Etch Technology and Process Integration for Nanopatterning
(Invited) Novel Surface Reactions in Low-Temperature Regime for High-Aspect-Ratio Dielectric Etching
2023 · Masanobu Honda, Ryutaro Suda, et al. · ECS Meeting Abstracts
Development of state-of-the-art atomic-level process and future outlook
2021 · Masanobu Honda, Takayuki Katsunuma, et al. · The Japan Society of Applied Physics
EUV defect reduction activities using coater/developer and etching technique
2021 · Takahiro Shiozawa, Keisuke Yoshida, et al. · Advances in Patterning Materials and Processes
Atomic layer etching process utilizing plasma
2019 · Sho Kumakura, Yoshihide Kihara, et al. · IEICE Technical Report; IEICE Tech. Rep.
Integrated atomic scale CD control and local variability reduction techniques
2019 · Toru Hisamatsu, Takayuki Katsunuma, et al. · Advanced Etch Technology and Process Integration for Nanopatterning
[INVITED] Latest trends of leading etch technology and future prospects
2019 · Masanobu Honda, Takayuki Katsunuma, et al. · The Japan Society of Applied Physics
New Patterning Technology by Integrating Atomic Layer Deposition Process to the Etching Flow
2017 · Takayuki KATSUNUMA, Toru HISAMATSU, et al. · Hyomen Kagaku
PDF
(Invited) Plasma-Enhanced Quasi-ALE and ALD Processing for Leading-Edge Microfabrication
2016 · Masanobu Honda, Takayuki Katsunuma, et al. · ECS Meeting Abstracts
Works count: 24
Citation count: 345
H-index: 8
I10-index: 8
Year
Topic
Type