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X.-Y. Liu
Observed name:
X.-Y Liu
Institution:
Motorola (United States)
Observed institutions:
Motorola (United States),
Los Alamos National Laboratory
OpenAlex ID:
A5025804166
A new investigation of copper's role in enhancing Al–Cu interconnect electromigration resistance from an atomistic view
1999
·
X.-Y Liu
, C.-L Liu
, et al.
·
Acta Materialia
·
85
Defect generation and diffusion mechanisms in Al and Al–Cu
1999
·
C.-L. Liu
, X.-Y. Liu
, et al.
·
Applied Physics Letters
·
45
Trapping and desorption of energetic Cu atoms on Cu(111) and (001) surfaces at grazing incidence
1999
·
D. E. Hanson
, J. D. Kress
, et al.
·
Physical review. B, Condensed matter
·
14
Ab initio modeling study of boron diffusion in silicon
2001
·
W Windl
, R Stumpf
, et al.
·
Computational Materials Science
·
11
Defect Generation and Diffusion Mechanisms in Al and Al-Cu
1998
·
C. - L. Liu
, X.-Y. Liu
, et al.
·
MRS Proceedings
·
3
Stress Effects on Al and Al(Cu) Thin Film Grain-Boundary Diffusion
1999
·
X.-Y. Liu
, C.-L. Liu
·
MRS Proceedings
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Works count:
6
Citation count:
158
H-index:
4
I10-index:
4
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