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Tolga Tekin
Observed names:
T Tekin,
T. Tekin,
Tekin Tolga,
Tekin, T,
Tekin, Tolga,
Tekin, TolgaXX4aut,
Tolga TEKIN
show all 7
Institution:
Fraunhofer Institute for Reliability and Microintegration
Observed institutions:
Fraunhofer Institute for Telecommunications, Heinrich Hertz Institute,
Japan Science and Technology Agency,
Fraunhofer Institute for Reliability and Microintegration,
Technische Universität Berlin,
Fraunhofer-Gesellschaft,
University of California, Davis
show all 6
ORCID:
0000-0002-1650-5543
Observed ORCID:
0000-0002-1650-5543
OpenAlex ID:
A5026067624
Silicon Photonic Circuits: On-CMOS Integration, Fiber Optical Coupling, and Packaging
2010
·
C Kopp
, Stéphane Bernabé
, et al.
·
IEEE Journal of Selected Topics in Quantum Electronics
·
269
Review of Packaging of Optoelectronic, Photonic, and MEMS Components
2011
·
Tolga Tekin
·
IEEE Journal of Selected Topics in Quantum Electronics
·
117
Active plasmonics in WDM traffic switching applications
2012
·
Sotirios Papaioannou
, Dimitrios Kalavrouziotis
, et al.
·
Scientific Reports
·
91
PDF
Dielectric‐loaded plasmonic waveguide components: Going practical
2013
·
Ashwani Kumar
, Jacek Gosciniak
, et al.
·
Laser & Photonics Review
·
68
PDF
Triple transit region photodiodes (TTR-PDs) providing high millimeter wave output power
2014
·
Vitaly Rymanov
, Andreas Stöhr
, et al.
·
Optics Express
·
62
Silicon photonics for terabit/s communication in data centers and exascale computers
2020
·
S. Bernabé
, Q. Wilmart
, et al.
·
Solid-State Electronics
·
55
Interfacing Dielectric-Loaded Plasmonic and Silicon Photonic Waveguides: Theoretical Analysis and Experimental Demonstration
2012
·
Odysseas Tsilipakos
, Alexandros Pitilakis
, et al.
·
IEEE Journal of Quantum Electronics
·
47
Packaging and Assembly for Integrated Photonics—A Review of the ePIXpack Photonics Packaging Platform
2010
·
Lars Zimmermann
, Giovan Battista Preve
, et al.
·
IEEE Journal of Selected Topics in Quantum Electronics
·
44
Dual SOA-MZI Wavelength Converters Based on III-V Hybrid Integration on a $\mu{\rm m}$-Scale Si Platform
2014
·
Dimitrios Fitsios
, Theonitsa Alexoudi
, et al.
·
IEEE Photonics Technology Letters
·
39
WDM-Enabled Optical RAM at 5 Gb/s Using a Monolithic InP Flip-Flop Chip
2016
·
S. Pitris
, C. Vagionas
, et al.
·
IEEE photonics journal
·
36
PDF
048Tb/s (12x40Gb/s) WDM transmission and high-quality thermo-optic switching in dielectric loaded plasmonics
2012
·
D. Kalavrouziotis
, S. Papaioannou
, et al.
·
Optics Express
·
31
Data Transmission and Thermo-Optic Tuning Performance of Dielectric-Loaded Plasmonic Structures Hetero-Integrated on a Silicon Chip
2011
·
Giannis Giannoulis
, Dimitrios Kalavrouziotis
, et al.
·
IEEE Photonics Technology Letters
·
27
Robust 71-76 GHz Radio-over-Fiber Wireless Link with High-Dynamic Range Photonic Assisted Transmitter and Laser Phase-Noise Insensitive SBD Receiver
2014
·
Andreas Stöhr
, Oleg Cojucari
, et al.
·
Optical Fiber Communication Conference
·
23
Measurement of Young’s modulus and residual stress of thin SiC layers for MEMS high temperature applications
2012
·
Oliver Pabst
, Michael Schiffer
, et al.
·
Microsystem Technologies
·
23
Co-Package Technology Platform for Low-Power and Low-Cost Data Centers
2021
·
Konstantinos Papatryfonos
, David R. Selviah
, et al.
·
Applied Sciences
·
21
PDF
3D Silicon Photonics Interposer for Tb/s Optical Interconnects in Data Centers with Double-Side Assembled Active Components and Integrated Optical and Electrical Through Silicon Via on SOI
2019
·
Bogdan Sirbu
, Yann Eichhammer
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
21
Compact Modules for Wireless Communication Systems in the E-Band (71–76 GHz)
2013
·
Javier Montero-de-Paz
, Ion Oprea
, et al.
·
Journal of Infrared Millimeter and Terahertz Waves
·
20
Alignment tolerant, low voltage, 023 Vcm, push-pull silicon photonic switches based on a vertical pn junction
2019
·
Andrea Zanzi
, Christos Vagionas
, et al.
·
Optics Express
·
13
CMOS compatible silicon etched V-grooves integrated with a SOI fiber coupling technique for enhancing fiber-to-chip alignment
2009
·
J. V. Galan
, P. Sanchis
, et al.
·
IEEE International Conference on Group IV Photonics (GFP)
·
13
Automated assembly of fast-axis collimation (FAC) lenses for diode laser bar modules
2009
·
Jörn Miesner
, Andre Timmermann
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
12
Integrated photonic 71–76 GHz transmitter module employing high linearity double mushroom-type 1.55 μm waveguide photodiodes
2012
·
V. Rymanov
, M. Palandoken
, et al.
·
International Topical Meeting on Microwave Photonics
·
11
Double mushroom 1.55-μm waveguide photodetectors for integrated E-band (60-90 GHz) wireless transmitter modules
2012
·
Vitaly Rymanov
, Tolga Tekin
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
11
g-Pack – a generic testbed package for Silicon photonics devices
2008
·
L. Zimmermann
, H. Schroder
, et al.
·
IEEE International Conference on Group IV Photonics (GFP)
·
11
$W$ -Band Coherent Wireless Link Using Injection-Locked Laser Diodes
2015
·
Shintaro Hisatake
, Guillermo Carpintero
, et al.
·
IEEE Photonics Technology Letters
·
10
Tb/s switching fabrics for optical interconnects using heterointegration of plasmonics and silicon photonics: The FP7 PLATON approach
2010
·
N. Pleros
, K. Vyrsokinos
, et al.
·
IEEE Photonics Society Annual Meeting
·
10
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Works count:
105
Citation count:
1,268
H-index:
17
I10-index:
25
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