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Jude E. Njoku
Observed names:
Jude Ebem Njoku,
Jude Ejikeme Ebem Njoku,
Jude Njoku
Institution:
University of Greenwich
Observed institution:
University of Greenwich
OpenAlex ID:
A5056806211
Thermal Effect of Cylindrical Heat Sink on Heat Management in LED Applications
2022
·
Mathias Ekpu
, Eugene A. Ogbodo
, et al.
·
Energies
·
13
PDF
Effect of component standoff height on thermo-mechanical reliability of ball grid array (BGA) solder joints operating in high-temperature ambient
2015
·
Jude E. Njoku
, Sabuj Mallik
, et al.
·
International Spring Seminar on Electronics Technology
·
8
Experimental Analysis of Thin Layer Drying of Ginger Rhizome in Convective Environment
2020
·
Gbasouzor Austin Ikechukwu
, Sabuj Mallik
, et al.
·
Advances in Science Technology and Engineering Systems Journal
·
7
PDF
Quantitative Evaluation of Voids in Lead Free Solder Joints
2015
·
Sabuj Mallik
, Jude Njoku
, et al.
·
Applied Mechanics and Materials
·
7
Effects of component stand-off height on reliability of solder joints in assembled electronic component
2015
·
Jude E. Njoku
, Sabuj Mallik
, et al.
·
4
Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors
2023
·
Jude E. Njoku
, Emeka H. Amalu
, et al.
·
Journal of Electronic Materials
·
3
Temperature Distribution and Boundary Condition on Heat Transfer from Discretized Element of Dried Ginger Rhizome Using MATLAB PDES for Optimal Preservation
2020
·
Austin Ikechukwu Gbasouzor
, Joshu Depiver
, et al.
·
Springer eBooks
·
1
Determination of Natural Logarithm of Diffusion Coefficient and Activation Energy of Thin Layer Drying Process of Ginger Rhizome Slices
2024
·
Austin Ikechukwu Gbasouzor
, Sam Nna Omenyi
, et al.
·
World Journal of Engineering and Technology
PDF
A study of the thermomechanical reliability of solder joints in surface mount electronics technology
2016
·
Jude E. Njoku
·
Greenwich Academic Literature Archive (University of Greenwich)
PDF
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Works count:
9
Citation count:
43
H-index:
4
I10-index:
1
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