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Author

Dong Hu

Observed name: Hu, Dong
ORCID: 0000-0002-3739-5750
Observed ORCID: 0000-0002-3739-5750
OpenAlex ID: A5026664536
Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study
2020 · Dong Hu, Zhen Cui, et al. · Results in Physics · 63
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Effects of hydrogen sulfide on the mechanical and thermal properties of cellulose insulation paper: A molecular dynamics simulation
2019 · Dongyuan Du, Chao Tang, et al. · Materials Chemistry and Physics · 43
Analysis and mechanism of adsorption of naphthenic mineral oil, water, formic acid, carbon dioxide, and methane on meta-aramid insulation paper
2019 · Xu Li, Chao Tang, et al. · Journal of Materials Science · 41
Effect of Aminosilane Coupling Agents with Different Chain Lengths on Thermo-Mechanical Properties of Cross-Linked Epoxy Resin
2018 · Yujing Tang, Chao Tang, et al. · Nanomaterials · 40
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High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging
2021 · Jiajie Fan, Dawei Jiang, et al. · Results in Physics · 38
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Effects of Defect and Temperature on the Mechanical Performance of WS2: A Multiscale Analysis
2021 · Hongyu Tang, Dong Hu, et al. · The Journal of Physical Chemistry C · 35
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High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling
2023 · Dong Hu, Cheng Qian, et al. · Journal of Materials Research and Technology · 33
Direct Z-scheme ZnS/HfS2 heterojunction for photocatalytic overall water splitting with high carrier mobility
2024 · Qingyi Feng, Dong Hu, et al. · International Journal of Hydrogen Energy · 31
Microstructural and mechanical anisotropy in pressure-assisted sintered copper nanoparticles
2025 · Leiming Du, Kai Liu, et al. · Acta Materialia · 28
Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip
2022 · Romina Sattari, Dong Hu, et al. · Applied Thermal Engineering · 24
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Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging
2024 · Wei Chen, Xu Liu, et al. · Materials & Design · 19
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Molecular dynamics simulations on mechanical behaviors of sintered nanocopper in power electronics packaging
2023 · Runding Luo, Dong Hu, et al. · Microelectronics Reliability · 18
Microscopic fracture toughness of notched porous sintered Cu micro-cantilevers for power electronics packaging
2024 · Dong Hu, Leiming Du, et al. · Materials Science and Engineering A · 17
Low power AlGaN/GaN MEMS pressure sensor for high vacuum application
2020 · Jianwen Sun, Dong Hu, et al. · Sensors and Actuators A Physical · 17
Effects of temperature and grain size on diffusivity of aluminium: electromigration experiment and molecular dynamic simulation
2022 · Zhen Cui, Yaqian Zhang, et al. · Journal of Physics Condensed Matter · 15
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Insights into sulfur and hydrogen sulfide induced corrosion of sintered nanocopper paste: A combined experimental and ab initio study
2024 · Wei Chen, Xu Liu, et al. · Materials & Design · 11
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Insights into the high-sulphur aging of sintered silver nanoparticles: An experimental and ReaxFF study
2021 · Dong Hu, Tijian Gu, et al. · Corrosion Science · 10
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Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application
2023 · Dong Hu, Mustafeez Bashir Shah, et al. · IEEE Transactions on Electron Devices · 5
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Warpage deformation analysis of AMB ceramic substrates in power modules
2024 · Dong Hu, Chieh Wang, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 4
Molecular dynamics simulation of grafting and modification of insulation paper cellulose
2016 · Song Zhang, Chao Tang, et al. · IEEE International Conference on High Voltage Engineering and Application (ICHVE) · 4
Rapid on-site nondestructive surface corrosion characterization of sintered nanocopper paste in power electronics packaging using hyperspectral imaging
2024 · Wei Chen, Shuo Feng, et al. · Microelectronics Reliability · 2
Effect of Composite Composition on the Contact Angle of B4C-xTiB2/Cu
2024 · Dong Hu, Xin Zhang, et al. · Journal of Wuhan University of Technology-Mater Sci Ed · 2
Reliability Analysis of Cu Sintered Die-Attach for SiC Power Devices: Mechanical, Electrical, and Thermal Evaluation
2024 · Xu Liu, Shaogang Wang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation
2023 · Cheng Qian, Dong Hu, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 2
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Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices
2023 · Leiming Du, Dong Hu, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 2
Works count: 37
Citation count: 510
H-index: 15
I10-index: 17
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