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Author

Baojun Qiu

Observed name: Qiu Baojun
ORCID: 0000-0002-5273-030X
Observed ORCID: 0000-0002-5273-030X
OpenAlex ID: A5026877191
Survey on Fatigue Life Prediction of BGA Solder Joints
2022 · Baojun Qiu, Jingang Xiong, et al. · Electronics · 56
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Evaluation of Solder Joint Reliability in 3D Packaging Memory Devices under Thermal Shock
2022 · Shuai Zhou, Zhenpei Lin, et al. · Electronics · 28
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Adaptive Hybrid Framework for Multiscale Void Inspection of Chip Resistor Solder Joints
2023 · Pan Xiao, Meng Xiao, et al. · IEEE Transactions on Instrumentation and Measurement · 18
Effect of Voids on the Thermal Fatigue Reliability of PBGA Solder Joints through Submodel Technology
2008 · Zhou Bin, Qiu Baojun · IEEE Electronics Packaging Technology Conference (EPTC) · 18
Survey of Reliability Research on 3D Packaged Memory
2023 · Shuai Zhou, Kaixue Ma, et al. · Electronics · 17
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A Lightweight Method for Detecting IC Wire Bonding Defects in X-ray Images
2023 · Daohua Zhan, Jian Lin, et al. · Micromachines · 13
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Vibration durability modeling and dynamic response analysis of PBGA mixed solder joints
2010 · Bin Zhou, Baojun Qiu, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 10
ATNet: A Defect Detection Framework for X-ray Images of DIP Chip Lead Bonding
2023 · Renbin Huang, Daohua Zhan, et al. · Micromachines · 8
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Study on a Novel Dual-Beam Flat-Roofed Sine Waveguide Traveling-Wave Tube
2022 · Shuanzhu Fang, Yanyu Wei, et al. · IEEE Transactions on Plasma Science · 3
Destructive Physical Analysis Methods of Flip Chip Packaging Devices for High Reliability
2021 · Zhou Shuai, Weng Zhangzhao, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 3
The Application Verification Method of DC/DC Converter Used in Aviation Environment
2024 · Jingsheng Liu, Baojun Qiu, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2
Research on Vibration Reliability of DIP Surface-Mounted Solder Joint after Pin Bend
2018 · Tao Lu, Yabin Zou, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2
The Component Level Reliability Verification of An Automotive Grade Microcontroller
2025 · Jingsheng Liu, Hui Tang, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 1
A Novel Rectangular Groove Sine Waveguide TWT Operating at 0.34 THz
2023 · Shuanzhu Fang, Liuxia Xie, et al. · IEEE International Vacuum Electronics Conference (IVEC) · 1
Effect of Ceramic Array Package Pinout Types on Solder Joints Thermal Reliability
2024 · Tao Lu, Weiguan Huang, et al. · International Conference on Electronic Packaging Technology (ICEPT)
Study on Electromigration Lifetime of Ni/solder/Cu Sandwich Structure with Different Pb Content
2023 · Jiang Xie, Baojun Qiu, et al. · International Conference on Electronic Packaging Technology (ICEPT)
A Novel Ridge-Loaded Sine Waveguide for 0.22THz Sheet Electron-Beam Traveling-Wave Tube
2022 · Shuanzhu Fang, Jun Luo, et al. · IEEE International Vacuum Electronics Conference (IVEC)
Design of a Terahertz Multi-Beam BWO Based upon Sine Waveguide
2022 · Shuanzhu Fang Xianghong Hu, Yue Zhi, et al. · IEEE International Vacuum Electronics Conference (IVEC)
Comprehensive Study of Various Short Failures on Printed Circuited Board
2018 · Xiao He, Baojun Qiu, et al. · SMTA International
Works count: 19
Citation count: 180
H-index: 8
I10-index: 7
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