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H. Noro
Observed names:
Hiroshi Noro,
弘司 野呂
Institution:
Nitto (Japan)
Observed institution:
Nitto (Japan)
OpenAlex ID:
A5027266677
A novel flip chip technology using non-conductive resin sheet
2002
·
S. Ito
, M. Mizutani
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
14
Study of encapsulating system for diversified area bump packages
2002
·
S. Ito
, M. Kuwamura
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
13
Special characteristic of future flip chip underfill materials and the process
2002
·
H. Usui
, M. Mizutani
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
13
High reliable and mass production-able flip chip package using non conductive film resin
2003
·
H. Usui
, M. Mizutani
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
4
A study of a new flip chip packaging process for diversified bump and land combination
2002
·
M. Mizutani
, S. Ito
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
4
Study of reliability and process ability for preset underfill sheet material as future standard flip chip packaging process
2002
·
H. Noro
, M. Mizutani
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
4
Design of encapsulating materials for advanced area bump packages
2002
·
S. Ito
, A. Kuroyanagi
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
2
A novel flip chip technology using nonconductive resin sheet
1999
·
S. Ito
, M. Mizutani
, et al.
·
IEEE Transactions on Components and Packaging Technologies
·
2
Transparent encapsulating resin for automotive applications
2010
·
Hisataka Ito
, Hiroshi Noro
, et al.
·
IEEE CPMT Symposium Japan (ICSJ)
有機無機ハイブリッド化による高屈折率化と低線膨張化技術 (マテリアルフォーカス:オプトロニクス 透明樹脂材料の更なる高屈折率化に関する技術トレンド)
2010
·
弘司 野呂
·
マテリアルステージ
A study of new flip chip packaging process for diversified bump and land combination
2002
·
H. Noro
, S. Ito
, et al.
·
IEMT/IMC Symposium
of Encapsulating System for Diversified Area
1997
·
Satoshi Ito
, M. Kuwamura
, et al.
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Works count:
12
Citation count:
56
H-index:
4
I10-index:
3
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