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Author

Bungo Tanaka

Institution: Tohoku University
ORCID: 0009-0002-3523-4221
Observed ORCID: 0009-0002-3523-4221
OpenAlex ID: A5027365034
An Advanced Remote-Plasma Assisted Ozone-Ethylene Radical (OER) Process for Cu-SiO2 Hybrid Bonding Yield Enhancement
2024 · Tatsunori Shino, Mariappan Murugesan, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 7
Scanning Probe Lithography with Negative and Positive Electron Beam Resists
2013 · Lydia Anggraini, Bungo Tanaka, et al. · Japanese Journal of Applied Physics · 7
Ozone-Ethylene Radical Activation of SiCN/Cu without Water Rinsing for Hybrid Bonding
2025 · Bungo Tanaka, Mariappan Murugesan, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 5
Characterization of Self-Nanoparticulated Cu-Cu Interconnection for Low-temperature Hybrid Bonding
2025 · Ryotaro Kawashima, Hirokatsu Sakamoto, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 5
Characterization of Ozone-Ethylene Radical Pretreatment for Hybrid Bonding without Water Rinsing Processes
2024 · Bungo Tanaka, Tatsunori Shino, et al. · International 3D Systems Integration Conference (3DIC) · 3
Development of Scanning Probe Parallel Nanowriting System with Electron Beam Resist
2007 · Naoki Matsuzuka, Bungo Tanaka, et al. · International Conference on Solid-State Sensors, Actuators and Microsystems · 3
High-Throughput Metrology of CMP-treated Surface Topography using Fizeau Interferometry for Hybrid Bonding
2026 · Ryoichi Sato, Hashimoto Hiroyuki, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 1
Synchrotron-Based Characterization of Cu/SiCN Pretreatment for Hybrid Bonding via Ozone/Ethylene Radical Activation
2026 · Bungo Tanaka, Mariappan Murugesan, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 1
Interfacial Analysis of Hybrid Bonding Using Water Surface Tension-Driven Self-Assembly for HBM
2026 · Kota Sasaki, Bungo Tanaka, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 1
Comprehensive Characterization of Surface Activation for Chip-to-Wafer Hybrid Bonding in 3D Flash Memory
2026 · Jingqi Zhang, Bungo Tanaka, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 1
Hybrid Bonding Technology: Challenges and Recent Trends
2026 · Bungo Tanaka, Takafumi Fukushima · Journal of The Japan Institute of Electronics Packaging
Implementation of agile die-level TSV formation and heterogeneous integration with standard multi-project wafer shuttle dies
2026 · Jiayi Shen, Akihiro Tominaga, et al. · Japanese Journal of Applied Physics
Low-temperature Cu/SiO 2 hybrid bonding by self-aligned in situ reductive Cu passivation
2026 · Ryotaro Kawashima, Hirokatsu Sakamoto, et al. · Applied Physics Express
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Metallization Challenges: Conformable Deposition for Super High-Aspect Ratio (> 100) Fine TGV and Cu Pillar Embedment for 1-mm-Deep Fat TGV
2026 · Chang Liu, Kiyoharu Mori, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
Die-level Via-last TSV formation and Heterogeneous 3D Integration with Multi-Project Wafers Using Photosensitive Temporary Adhesives for Agile Prototyping
2026 · Jiayi Shen, Akihiro Tominaga, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
Fabrication of the 3D-stacked retinal prosthesis chip to realize high-performance retinal prosthesis
2022 · Aoba Onishi, Ryotaro Bamba, et al. · International Conference on Solid State Devices and Materials (SSDM)
Development of TiN-capped ZnO-based transparent stimulus electrodes for 3D-stacked artificial retina chip
2021 · Aoba Onishi, Bungo Tanaka, et al. · The Japan Society of Applied Physics
Works count: 17
Citation count: 34
H-index: 4
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