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Keun-Soo Kim

Observed names: K.S. Kim, Keun-Soo kIM
Institution: Hoseo University
ORCID: 0000-0002-8275-8362
Observed ORCID: 0000-0002-8275-8362
OpenAlex ID: A5028235867
Enhanced ductility and oxidation resistance of Zn through the addition of minor elements for use in wide-gap semiconductor die-bonding materials
2012 · S.W. Park, T. Sugahara, et al. · Journal of Alloys and Compounds · 28
Joining of lotus-type porous copper to alumina substrate by direct bonded copper technique
2025 · Sang-Gyu Choi, Sangwook Kim, et al. · Materials Science in Semiconductor Processing · 5
Microstructure and mechanical properties of transient liquid phase bonded joints with lotus-type porous Cu interlayer
2025 · Hong-Seok Kim, Seong-Min Cho, et al. · Journal of Materials Research and Technology · 3
Active metal brazing of lotus-type porous Cu to Al2O3 substrate using Cu-Sn-Ti alloy
2025 · Seung-Min Cho, Keun-Soo Kim, et al. · Journal of Materials Science · 2
Optimization of Direct Bonding Process for Lotus-Type Porous Copper to Alumina Substrates
2025 · Sang-Gyu Choi, Sangwook Kim, et al. · Journal of Manufacturing and Materials Processing · 2
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Evaluation of reliability of lotus-type porous Cu joint soldered by SAC305
2025 · Jae-Ho Shin, Keun-Soo Kim, et al. · Microelectronics Reliability · 2
Room temperature sintering of ag nano-scale particles with drying of the solvent
2008 · Daisuke Wakuda, Keun-Soo Kim, et al. · International Conference on Polymers and Adhesives in Microelectronics and Photonics · 2
Predictive Modeling of Shear Strength for Lotus-Type Porous Copper Bonded to Alumina
2025 · Sang-Gyu Choi, Sangwook Kim, et al. · Metals · 1
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Reliability Improvement Mechanisms of Lotus-Type Porous Copper-Based Joining Technologies for Power Semiconductor Packaging
2026 · Seung-Min Cho, Jae-Ho Shin, et al. · Journal of Welding and Joining
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An AOP-Based Integrated In Vitro and In Vivo Assessment of the Non-Genotoxic Carcinogenic Potential of Multi-Walled Carbon Nanotubes
2026 · Minju Kim, Heesung Hwang, et al. · Nanomaterials
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Mechanical behavior of lotus-type porous Cu/Al2O3 joints fabricated by direct bonded copper
2026 · Sang-Gyu Choi, Sangwook Kim, et al. · Materials Today Communications
Enhancing thermal reliability of ceramic substrates using lotus-type porous copper
2025 · Sang-Gyu Choi, Sangwook Kim, et al. · Materials Science in Semiconductor Processing
Effect of Air-HAST Conditions on Sn Whisker Growth
2019 · Chulmin Oh, Sangjoo Oh, et al. · Journal of Welding and Joining
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Works count: 13
Citation count: 45
H-index: 3
I10-index: 1
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