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N. Seliger

Observed names: Norbert Seliger, Seliger, Norbert
ORCID: 0000-0002-2308-1558
Observed ORCID: 0000-0002-2308-1558
OpenAlex ID: A5030708935
Reliability model for Al wire bonds subjected to heel crack failures
2000 · S. Ramminger, N. Seliger, et al. · Microelectronics Reliability · 155
Planar Interconnect Technology for Power Module System Integration
2012 · Karl Weidner, M. Kaspar, et al. · 62
Interleaving optimization in synchronous rectified DC/DC converters
2004 · M. Gerber, J.A. Ferreira, et al. · IEEE Power Electronics Specialists Conference (PESC) · 60
A High-Density Heat-Sink-Mounted Inductor for Automotive Applications
2004 · M. Gerber, J.A. Ferreira, et al. · IEEE Transactions on Industry Applications · 42
High temperature reliability on automotive power modules verified by power cycling tests up to 150°C
2003 · G. Coquery, G. Lefranc, et al. · Microelectronics Reliability · 41
High Density Packaging of the Passive Components in an Automotive DC/DC Converter
2005 · M. Gerber, J.A. Ferreira, et al. · IEEE Transactions on Power Electronics · 36
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Reliability analysis of power MOSFET’s with the help of compact models and circuit simulation
2002 · A. Castellazzi, R. Kraus, et al. · Microelectronics Reliability · 28
Design and evaluation of an automotive integrated system module
2005 · M. Gerber, J.A. Ferreira, et al. · IEEE Industry Applications Society Annual Meeting (IAS) · 27
Hot-Spot Meaurements and Analysis of Electro-Thermal Effects in Low-Voltage Power-MOSFET’s
2003 · A. Castellazzi, V. Kartal, et al. · Microelectronics Reliability · 25
Interferometric temperature mapping during ESD stress and failure analysis of smart power technology ESD protection devices
2000 · C. Fürböck, D. Pogany, et al. · Journal of Electrostatics · 25
Integral 3-D Thermal, Electrical and Mechanical Design of an Automotive DC/DC Converter
2005 · M. Gerber, J.A. Ferreira, et al. · IEEE Transactions on Power Electronics · 24
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Reliable power electronics for automotive applications
2002 · N. Seliger, E. Wolfgang, et al. · Microelectronics Reliability · 16
Time-resolved analysis of self-heating in power VDMOSFETs using backside laserprobing
1997 · N. Seliger, P. Habaš, et al. · Solid-State Electronics · 16
Reliability of High Temperature Inverters for HEV
2007 · F. Renken, G. Ehbauer, et al. · Power Conversion Conference · 15
A very high density, heatsink mounted inductor for automotive applications
2003 · M. Gerber, J.A. Ferreira, et al. · IEEE Industry Applications Society Annual Meeting (IAS) · 13
Thermal simulation and characterization of gaas micromachined power-sensor microsystems
1998 · E. Burian, D. Pogany, et al. · Sensors and Actuators A Physical · 13
A study of backside laser-probe signals in MOSFETs
1996 · Norbert Seliger, Predrag Habaš, et al. · Microelectronic Engineering · 13
Design and Performance of a 200 kHz GaN Motor Inverter with Sine Wave Filter
2017 · Franz Stubenrauch, N. Seliger, et al. · 12
Backside laserprober characterization of thermal effects during high current stress in smart power ESD protection devices
2002 · C. Furbock, N. Seliger, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 12
A differential backside laserprobing technique for the investigation of the lateral temperature distribution in power devices
2003 · C. Furbock, R. Thalhammer, et al. · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · 11
Damage analysis in smart-power technology electrostatic discharge (ESD) protection devices
1999 · D. Pogany, N. Seliger, et al. · Microelectronics Reliability · 11
Reliability aspects of semiconductor devices in high temperature applications
2003 · W. Kanert, H. Dettmer, et al. · Microelectronics Reliability · 9
High temperature, high power density packaging for automotive applications
2004 · M. Gerber, J.A. Ferreira, et al. · IEEE Annual Conference on Power Electronics Specialist · 8
Interferometric temperature mapping during ESD stress and failure analysis of smart power technology ESD protection devices
2003 · C. Furbock, D. Pogany, et al. · Electrical Overstress/Electrostatic Discharge Symposium · 8
Internal characterization of IGBTs using the backside laser probing technique-interpretation of measurement by numerical simulation
2002 · R. Thalhammer, C. Furbock, et al. · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · 8
Works count: 72
Citation count: 785
H-index: 14
I10-index: 21
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