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Vithyacharan Retnasamy

Observed names: Retnasamy Vithyacharan, Retnasamy, Vithyacharan, V. Retnasamy, retnasamy, Vithyacharan
ORCID: 0000-0001-7187-0108
Observed ORCID: 0000-0001-7187-0108
OpenAlex ID: A5031099771
FDTD analysis of structured metallic nanohole films for LSPR-based biosensor
2015 · Fairus Atida Said, P. Susthitha Menon, et al. · IEEE Regional Symposium on Micro and Nanoelectronics · 26
Interaction of Surface Roughness and Copper Ball Adhesion Using Shearing Simulation
2012 · Vithyacharan Retnasamy, Zaliman Sauli, et al. · International Conference on Computational Intelligence, Modelling and Simulation · 13
A Brief Review on Breast Carcinoma and Deliberation on Current Non Invasive Imaging Techniques for Detection
2017 · Rajendaran Vairavan, Othman Abdullah, et al. · Current Medical Imaging Formerly Current Medical Imaging Reviews · 11
A review: Application of adhesive bonding on semiconductor interconnection joints
2017 · Sarveshvaran Suppiah, Nestor Rubio Ong, et al. · AIP conference proceedings · 11
Effects of air temperature and velocity on the drying kinetics and product particle size of starch from arrowroot (Maranta arundinacae)
2017 · Alvin R. Caparanga, Rachael Anne L. Reyes, et al. · EPJ Web of Conferences · 11
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Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS
2013 · Yap Boon Kar, Noor Azrina Talik, et al. · Microelectronics International · 11
Wire Bond Shear Test Simulation on Sharp Groove Surface Bond Pad
2012 · Z. Sauli, V. Retnasamy, et al. · Advanced materials research · 11
Shear Stress Analysis Study Using Surface Morphology Correlation with Aluminium Ball Adhesion
2012 · Vithyacharan Retnasamy, Zaliman Sauli, et al. · International Conference on Computational Intelligence, Modelling and Simulation · 11
Shearing Speed Induced Stress Comparison on Gold and Copper Ball Interconnection
2012 · Zaliman Sauli, Vithyacharan Retnasamy, et al. · International Conference on Computational Intelligence, Modelling and Simulation · 10
High Power LED Thermal and Stress Simulation on Copper Slug
2013 · R. Vairavan, Z. Sauli, et al. · UKSim International Conference on Computer Modelling and Simulation (UKSim) · 9
Measurement of PCI connector tilts using phase-shift fringe projection
2007 · V. Retnasamy, M. M. Ratnam · The International Journal of Advanced Manufacturing Technology · 9
Barium strontium titanate (BST) thin film analysis on different layer and annealing temperature
2017 · Y. C. Teh, N. R. Ong, et al. · AIP conference proceedings · 8
5mm X 5mm Copper-Diamond Composite Slug Stress Evaluation on LED
2013 · Rajendaran Vairavan, Zaliman Sauli, et al. · Asia Modelling Symposium · 8
Solid State Lighting Stress and Junction Temperature Evaluation on Operating Power
2013 · Z. Sauli, V. Retnasamy, et al. · UKSim International Conference on Computer Modelling and Simulation (UKSim) · 8
Polymer Core BGA Stress Analysis at Minimal Vertical Loading
2012 · Z. Sauli, V. Retnasamy, et al. · Advanced materials research · 8
A review on solder reflow and flux application for flip chip
2017 · Sarveshvaran Suppiah, Nestor Rubio Ong, et al. · AIP conference proceedings · 7
3D mapping of breast surface using digital fringe projection
2017 · Rajendaran Vairavan, Vithyacharan Retnasamy, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 6
Gold Ball Shear Stress Analysis on Different Surface Morphology
2012 · Vithyacharan Retnasamy, Zaliman Sauli, et al. · International Conference on Computational Intelligence, Modelling and Simulation · 6
Polymer Core BGA Vertical Stress Loading Analysis
2012 · Zaliman Sauli, Vithyacharan Retnasamy, et al. · International Conference on Computational Intelligence, Modelling and Simulation · 6
Stress Analysis on Through Holes in PCB
2012 · Zaliman Sauli, Vithyacharan Retnasamy, et al. · International Conference on Computational Intelligence, Modelling and Simulation · 6
The optimization of ultrasonic power and bonding time for thermosonic flip chip bonding
2018 · M. R. Lim, Z. Sauli, et al. · AIP conference proceedings · 5
A short review on thermosonic flip chip bonding
2017 · Sarveshvaran Suppiah, Nestor Rubio Ong, et al. · AIP conference proceedings · 5
Contact Angle Analysis on Glass Based Surface
2014 · Muhammad Hafiz Ab Aziz, Zaliman Sauli, et al. · Applied Mechanics and Materials · 5
Shear Ram Height Investigation for Gold Wire Bond Shear Test
2012 · Z. Sauli, V. Retnasamy, et al. · Advanced materials research · 5
Complex background subtraction for biometric identification
2007 · A. Khalifa, K. Sundaraj, et al. · International Conference on Intelligent and Advanced Systems · 5
Works count: 182
Citation count: 337
H-index: 9
I10-index: 9
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