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Seonghi Lee
Institution:
Korea Advanced Institute of Science and Technology
Observed institution:
Korea Advanced Institute of Science and Technology
ORCID:
0000-0003-4829-2551
Observed ORCID:
0000-0003-4829-2551
OpenAlex ID:
A5031268175
Signal Integrity Analysis of Through-Silicon Via (TSV) With a Silicon Dioxide Well to Reduce Leakage Current for High-Bandwidth Memory Interface
2023
·
Hyunwoong Kim
, Seonghi Lee
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
24
Foreign Object Detection of Wireless Power Transfer System Using Sensor Coil
2021
·
Seokhyeon Son
, Seonghi Lee
, et al.
·
IEEE Wireless Power Transfer Conference
·
22
Modeling, Verification, and Signal Integrity Analysis of High-Speed Signaling Channel with Tabbed Routing in High Performance Computing Server Board
2021
·
Kyunghwan Song
, Jongwook Kim
, et al.
·
Electronics
·
12
PDF
3D-IC Power Distribution Network (PDN) Impedance Prediction using Deep Learning (DL)
2023
·
Dongryul Park
, Seunghun Ryu
, et al.
·
IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
·
10
A Novel Interposer Channel Structure with Vertical Tabbed Vias to Reduce Far-End Crosstalk for Next-Generation High-Bandwidth Memory
2022
·
Hyunwoong Kim
, Seonghi Lee
, et al.
·
Micromachines
·
9
PDF
Deep Reinforcement Learning-based Decoupling Capacitor Optimization Method for Multi-Power Domain considering Transfer Noise in 3D-ICs
2022
·
Seonghi Lee
, Hyunwoong Kim
, et al.
·
IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
·
8
A Fast SerDes Equalizer Effect-Included Worst Eye Diagram Estimation Method for High-Speed Serial Links
2025
·
Seonghi Lee
, Seunghun Ryu
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
7
Optimization of the Power/Ground Ball Map in 3-D-IC BGA Packages With Multiple Power Domains Using Deep Reinforcement Learning
2024
·
Seunghun Ryu
, Dongryul Park
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
7
Deep Reinforcement Learning-based Power Distribution Network Structure Design Optimization Method for High Bandwidth Memory Interposer
2021
·
Seonghi Lee
, Hyunwoong Kim
, et al.
·
IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
·
7
Design and Analysis of Double-side Characteristic Impedance Compensation Structure in 2.5D / 3D Package for High-speed Serial Link
2023
·
Seonghi Lee
, Hyunwoong Kim
, et al.
·
IEEE International Symposium on Electromagnetic Compatibility
·
6
Modeling and Signal Integrity Analysis of Mounting Pad with Layer-cutting to reduce Impedance Mismatch for Dual-In-Line Memory Module (DIMM)
2021
·
Hyunwoong Kim
, Jongwook Kim
, et al.
·
IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
·
6
Reinforcement Learning-based Power/Ground Ball Map Design Optimization for Multi-Power Domain in 3D-ICs Package
2024
·
Seunghun Ryu
, Dongryul Park
, et al.
·
IEEE International Symposium on Electromagnetic Compatibility
·
5
Design Methodology of Meshed Ground Plane for Signal Integrity Enhancement in High-Performance Computing Systems
2025
·
Hyunwoo Kim
, Changmin Lee
, et al.
·
4
A Quantitative Channel Pre-Evaluation Method using Eye Aperture for Low-Power Double Data Rate (LPDDR)
2024
·
Seonghi Lee
, Dongryul Park
, et al.
·
4
Reinforcement Learning-Based via Placement Optimization in Package Substrate for Multiple Power Domain 3D-ICs
2025
·
Seunghun Ryu
, Seonghi Lee
, et al.
·
IEEE International Symposium on Electromagnetic Compatibility
·
3
Enhanced Modeling Method of Package Power Distribution Network (PDN) for Multiple Power Domain 3D-ICs
2025
·
Seonghi Lee
, Seunghun Ryu
, et al.
·
3
Linear Equalizer Effect-included Worst Eye Diagram Estimation Method for PCIe 6.0
2024
·
Seonghi Lee
, Hyunwoong Kim
, et al.
·
IEEE International Symposium on Electromagnetic Compatibility
·
3
Design Methodology of Through-Silicon via for Crosstalk Optimization Based on Impedance
2024
·
Hyunwoong Kim
, Seonghi Lee
, et al.
·
3
Signal Integrity Analysis of Notch-Routing to Reduce Near-End Crosstalk for Tightly Coupled and Short Microstrip Channel
2023
·
Seunghun Ryu
, Hyunwoong Kim
, et al.
·
IEEE International Symposium on Electromagnetic Compatibility
·
3
Signal Integrity Analysis and Design for Cascaded Wire Bonding of Low-Power Double Data Rate (LPDDR)
2024
·
Seunghun Ryu
, Hyunwoong Kim
, et al.
·
2
Signal Integrity Analysis and Design of Branch Structure Wire-bonding for Low Power Double Data Rate (LPDDR)
2025
·
Dongkyun Kim
, Seonghi Lee
, et al.
·
1
An Efficient SPICE-compatible Model for Fast Co-simulation of Signal and Power Integrity on Multilayer PCB with Arbitrary Shape
2024
·
Hyunwoo Kim
, Dongryul Park
, et al.
·
IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
·
1
5G Base Station Electromagnetic Field Strength Estimation Method in Complex Hotspot Area using Deep Learning
2024
·
Dongryul Park
, Seunghun Ryu
, et al.
·
IEEE International Symposium on Electromagnetic Compatibility
·
1
Power Integrity Design of Mobile 3D-IC Based on the Allocation of Optimal Number of TSV, BGA, and Via
2023
·
Hyunwoong Kim
, Seonghi Lee
, et al.
·
IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
·
1
Multilayer Meshed Power/Ground Plane Modeling Method for Interposer Power Distribution Network (PDN) in Advanced System-in-Package (SiP)
2026
·
Hyunwoo Kim
, Jinwook Lee
, et al.
·
International Conference on Electromagnetics in Advanced Applications (ICEAA)
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Works count:
45
Citation count:
153
H-index:
7
I10-index:
4
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