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Kalyan Biswas
Observed name:
K. Biswas
Observed institution:
Ibiden (Japan)
ORCID:
0000-0002-5044-0659
Observed ORCID:
0000-0002-5044-0659
OpenAlex ID:
A5031299467
Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package
2009
·
Xiaowu Zhang
, T.C. Chai
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
113
Fin shape influence on analog and RF performance of junctionless accumulation-mode bulk FinFETs
2018
·
Kalyan Biswas
, Angsuman Sarkar
, et al.
·
Microsystem Technologies
·
39
A Review on Machine Learning Approaches for Predicting the Effect of Device Parameters on Performance of Nanoscale MOSFETs
2021
·
Rachita Ghoshhajra
, Kalyan Biswas
, et al.
·
Devices for Integrated Circuit (DevIC)
·
38
Spacer engineering for performance enhancement of junctionless accumulation‐mode bulk FinFETs
2016
·
Kalyan Biswas
, Angsuman Sarkar
, et al.
·
IET Circuits Devices & Systems
·
37
Impact of barrier thickness on Analog, RF and Linearity performance of nanoscale DG heterostructure MOSFET
2015
·
Kalyan Biswas
, Angsuman Sarkar
, et al.
·
Superlattices and Microstructures
·
32
A review of energy harvesting technology and its potential applications
2017
·
Indrajit Sil
, Sagar Mukherjee
, et al.
·
Environmental and Earth Sciences Research Journal
·
29
PDF
Impact of Fin Width Scaling on RF/Analog Performance of Junctionless Accumulation-Mode Bulk FinFET
2016
·
Kalyan Biswas
, Angsuman Sarkar
, et al.
·
ACM Journal on Emerging Technologies in Computing Systems
·
28
Device Performance Prediction of Nanoscale Junctionless FinFET Using MISO Artificial Neural Network
2022
·
Rachita Ghoshhajra
, Kalyan Biswas
, et al.
·
Silicon
·
25
Effect of varying Indium concentration of InGaAs channel on device and circuit performance of nanoscale double gate heterostructure MOSFET
2018
·
Kalyan Biswas
, Angsuman Sarkar
, et al.
·
Micro & Nano Letters
·
25
Linearity and Analog Performance Analysis of Silicon Junctionless Bulk FinFET Considering Gate Electrode Workfunction Variability and Different Fin Aspect Ratio
2021
·
Kalyan Biswas
, Angsuman Sarkar
, et al.
·
Silicon
·
16
Assessment of Dielectrics and Channel Doping Impact in Nanoscale Double Gate III–V MOSFET with Heavily Doped Source/Drain Region
2017
·
K. Biswas
, A. Sarkar
, et al.
·
Materials Focus
·
15
Design and Optimization of Bump Structures of Large Die Fine Pitch Copper/Low-k FCBGA and Copper Post Interconnections
2008
·
Kalyan Biswas
, Shiguo Liu
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
14
Optimizing Fin Aspect Ratio of Junctionless Bulk FinFET for Application in Analog/RF Circuit
2018
·
Kalyan Biswas
, Chandan Kumar Sarkar
·
2018 IEEE Electron Devices Kolkata Conference (EDKCON)
·
12
MEMS‐based Optical Switches
2022
·
Kalyan Biswas
, Angsuman Sarkar
·
Wiley eBooks
·
10
Ensemble Learning strategy in modeling of future generation nanoscale devices using Machine Learning
2023
·
Rachita Ghoshhajra
, Kalyan Biswas
, et al.
·
Devices for Integrated Circuit (DevIC)
·
9
High Electron Mobility Transistor: Physics-Based TCAD Simulation and Performance Analysis
2022
·
Kalyan Biswas
, Rachita Ghoshhajra
, et al.
·
Springer tracts in electrical and electronics engineering
·
6
Structural design and optimization of MEMS based capacitive accelerometer
2017
·
Keya Sanyal
, Kalyan Biswas
·
Devices for Integrated Circuit (DevIC)
·
6
Development of numerical modeling approach on substrate warpage prediction
2012
·
K. Biswas
, Shiguo Liu
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
5
Effects of detailed substrate modeling and solder layout design on the 1st and 2nd level solder joint reliability for the large die FCBGA
2008
·
Kalyan Biswas
, Shiguo Liu
, et al.
·
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
·
5
Structural design for Cu/low-K larger die flip chip package
2006
·
Kalyan Biswas
, Shiguo Liu
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
5
Investigation of Design Parameters in MEMS Based Piezoelectric Vibration Energy Harvester
2018
·
Indrajit Sil
, Kalyan Biswas
·
2018 IEEE Electron Devices Kolkata Conference (EDKCON)
·
4
Design and performance analysis of a MEMS Based Area-Variation Capacitive Accelerometer with Readout Circuit
2024
·
Mahua Raha Patra
, Kalyan Biswas
·
Journal of Integrated Circuits and Systems
·
3
PDF
Design Optimization of CMOS Thermoelectric Energy Harvester for High Thermoelectric Efficiency
2018
·
Indrajit Sil
, Sagar Mukherjee
, et al.
·
International Conference on Electronics, Materials Engineering & Nano-Technology (IEMENTech)
·
3
The 1st Level & 2nd Level Solder Joint Reliability Co-design for Larger Die Flip Chip Package
2007
·
Kalyan Biswas
, Shiguo Liu
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
3
Performance evaluation of junctionless accumulation-mode FinFET using TCAD-enabled deep learning approach
2025
·
Rachita Ghoshhajra
, Kalyan Biswas
, et al.
·
Journal of the Korean Physical Society
·
2
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Works count:
59
Citation count:
498
H-index:
12
I10-index:
14
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