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Chi-Sheng Chung

Observed names: C. M. Chung, Chi-sheng Chung
ORCID: 0009-0000-1074-3818
Observed ORCID: 0009-0000-1074-3818
OpenAlex ID: A5031728477
Nanotransfer Printed Dual-Layer Metasurfaces for Infrared Cut-off Applications
2024 · Tzu-Wei Yeh, Yu-Heng Hung, et al. · ACS Applied Nano Materials · 12
A challenge of 45 nm extreme low-k chip using Cu pillar bump as 1st interconnection
2010 · Po-Jen Cheng, C. M. Chung, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 8
The SnAgCu solder joint integrity in WLCSP for green conversion
2005 · J.C.B. Lee, Chi-sheng Chung, et al. · International Symposium on Advanced Packaging Materials · 7
Loading Operation Efficiency for International Air Express at a Spoke Airport
2023 · Hua-An Lu, Chi-Sheng Chung · Aviation · 3
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Integrated UV/IR-cut optical filter with nanoimprinted pyramid diffuser featuring tailored light diffusion and hydrophobicity
2025 · Chih-Han Wu, Chao-Te Lee, et al. · Micro and Nano Engineering
Freighter Loading Efficiency at Airports for International Air Express
2020 · Hua-An Lu, Chi-Sheng Chung · MATEC Web of Conferences
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Thermal-Electrical Co-simulation for Wafer-level Chip Scale Package Maximum Bearing Current
2008 · Rui-Yu, Shu-Qiang Zhang, et al. · IEEE Electronics Packaging Technology Conference (EPTC)
The SnAgCu Solder Joint Integrity of Green WLCSP in Lead Free SMT
2005 · Jeffrey C.B. Lee, Chi-Sheng Chung, et al. · Pan Pacific Symposium
Board level reliability test of MPBGA assembly
2003 · Chi-Sheng Chung, P.J. Zheng, et al. · International Symposium on Electronic Materials and Packaging (EMAP)
Works count: 9
Citation count: 30
H-index: 3
I10-index: 1
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