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Erwan Basiron
Institutions:
Western Digital (United States),
National University of Malaysia
Observed institutions:
Western Digital (United States),
National University of Malaysia
ORCID:
0009-0005-0397-9466
Observed ORCID:
0009-0005-0397-9466
OpenAlex ID:
A5031928760
Cardinal and Ordinal Directions Approach in Investigating Arrayed Solder Joints Crack Propagation of Ball Grid Array Semiconductor Packages
2022
·
Adlil Aizat Ismail
, Maria Abu Bakar
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
15
Laser Rework Process for Efficient Lead-Free Solder Joints Ball Grid Array (BGA) Component Rework
2024
·
Adlil Aizat Ismail
, Maria Abu Bakar
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
9
Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint
2022
·
Adlil Aizat Ismail
, Maria Abu Bakar
, et al.
·
Scientific Reports
·
9
PDF
Undissolved gold in fine-pitch BGA solder joint under thermal cycling test
2024
·
Adlil Aizat Ismail
, Maria Abu Bakar
, et al.
·
Journal of Materials Science Materials in Electronics
·
5
Board Level-Component Solder Joints Normalized Crack Severity Index of Solid-State Drive With Different Reliability Temperature Cycle Test Profiles
2025
·
Erwan Basiron
, Adlil Aizat Ismail
, et al.
·
IEEE Transactions on Device and Materials Reliability
·
3
Predictive Modeling of IMC Growth in BGA Component Solder Joints Using Artificial Neural Networks Under Rework and Temperature Cycling Conditions
2025
·
Adlil Aizat Ismail
, Maria Abu Bakar
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
2
Artificial Neural Networks Analysis for Predicting Gold Diffusion in Solder Joints Under Various Rework and Thermal Cycling Conditions
2025
·
Adlil Aizat Ismail
, Maria Abu Bakar
, et al.
·
Springer proceedings in physics
·
2
Thermal Management on the Solder Joints of Adjacent Ball Grid Array (BGA) Rework Components Using Laser Soldering
2023
·
Adlil Aizat Ismail
, Maria Abu Bakar
, et al.
·
Springer proceedings in physics
·
2
Intermetallic Compound Thickness of Ball Grid Array Solder Joints Under Thermal Cycling Test Using ANOVA
2022
·
Adlil Aizat Ismail
, Maria Abu Bakar
, et al.
·
IEEE/CPMT International Electronics Manufacturing Technology Symposium
·
2
Laser Rework Reliability: Impact of Heat Source on Lead-Free Solder Joints in Adjacent BGA Components
2025
·
Adlil Aizat Ismail
, Maria Abu Bakar
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
1
Influence of Epoxy Molding Compounds on Crack Severity in Lead-Free Solder Joints of Mirrored NAND Flash BGA Packages Under Thermal Cycling Conditions
2025
·
Muhammad Nizam Ilias
, Maria Abu Bakar
, et al.
·
Springer proceedings in physics
·
1
Crack Severity Analysis in Predicting Solder Joint Reliability for Mirrored Flip Chip Ball Grid Array Packages
2025
·
Muhammad Nizam Ilias
, Maria Abu Bakar
, et al.
·
Journal of Failure Analysis and Prevention
Solid State Drive (SSD) End to End (e2e) Reliability Prediction, Characterization and Control
2021
·
Mohd Azman Abdul Latif
, Erwan Basiron
·
European Safety and Reliability Conference (ESREL)
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Works count:
13
Citation count:
51
H-index:
4
I10-index:
1
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