Author

Sven Dewilde

Observed name: Dewilde, Sven

Institution: IMEC

Observed institutions: IMEC, KU Leuven

ORCID: 0000-0003-2269-2127

Observed ORCID: 0000-0003-2269-2127

OpenAlex ID: A5032092089

Recycling of bonded NdFeB permanent magnets using ionic liquids

2020 · Mehmet Ali Recai Önal, Sven Dewilde, et al. · Green Chemistry · 63

PDF

Ionic liquids as solvents for PPTA oligomers

2015 · Sven Dewilde, Wim Dehaen, et al. · Green Chemistry · 60

PDF

Synthesis of Poly- p -phenylene Terephthalamide (PPTA) in Ionic Liquids

2017 · Sven Dewilde, Tom Vander Hoogerstraete, et al. · ACS Sustainable Chemistry & Engineering · 41

PDF

The Challenges and Solutions of Cu/SiCN Wafer-to-Wafer Hybrid Bonding Scaling Down to 400nm Pitch

2023 · Soon-Aik Chew, Boyao Zhang, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 39

Polymerization of PPTA in Ionic Liquid/Cosolvent Mixtures

2017 · Sven Dewilde, Jonas Winters, et al. · Macromolecules · 27

PDF

Scaling Cu/SiCN Wafer-to-Wafer Hybrid Bonding down to 400 nm interconnect pitch

2024 · Boyao Zhang, Soon-Aik Chew, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 26

700nm pitch Cu/SiCN wafer-to-wafer hybrid bonding

2022 · Soon-Aik Chew, Serena Iacovo, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 20

Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies and Bond Pad Pitch Scaling Down to 2 µm

2024 · Ye Lin, Pieter Bex, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 19

Wafer-to-Wafer Hybrid Bonding Technology with 300nm Interconnect Pitch

2025 · Stefaan Van Huylenbroeck, Soon Aik Chew, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 15

Wafer-to-Wafer Hybrid Bonding Technology with 200nm Interconnect Pitch

2026 · Stefaan Van Huylenbroeck, Lieve Bogaerts, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 10

ALD Barrier Deposition on Porous Low-k Dielectric Materials for Interconnects

2011 · Sven Van Elshocht, Annelies Delabie, et al. · ECS Transactions · 8

PDF

Self-formed Barrier using Cu-Mn Alloy Seed applied to a 400nm Pitch Wafer-to-Wafer Hybrid Bonding Technology

2025 · Stefaan Van Huylenbroeck, Soon Aik Chew, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4

Wet-Chemical Cu Cleaning for Fine-Pitch Hybrid Bonding

2025 · Kohei Nakayama, Kenta Hayama, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4

Towards SoCs leveraging 200nm wafer-to-wafer interconnection pitch

2025 · Joeri De Vos, James Myers, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 3

Mitigating Connected PAD Corrosion in Hybrid Bonding

2025 · Soon-Aik Chew, Yoichi Tanaka, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 2

Corrosion-Free Copper Pad Recess Enabled by Wet Acid Etching and Functional Water Rinse for Hybrid Bonding Applications

2026 · Yang Han, Yoichi Tanaka, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena

PDF

A Data Driven Roadmap to Sub 25 nm Bonding Overlay in Wafer to Wafer Hybrid Bonding

2026 · Serena Iacovo, koen D'havé, et al. · Research Square

PDF

Understanding Scaling and Temperature Limits in Cu Bulge-Out Mechanism for Hybrid Wafer-to-Wafer Bonding

2026 · Joke De Messemaeker, Boyao Zhang, et al. · IEEE Electronic Components and Technology Conference (ECTC)

Wafer to Wafer Hybrid Bonding Pitch Scaling Challenges (Invited)

2026 · Stefaan Van Huylenbroeck, Soon Aik Chew, et al. · IEEE International Reliability Physics Symposium proceedings

Wafer to Wafer hybrid bonding pitch scaling challenges

2026 · IEEE International Symposium on Reliability Physics 2026, Beyne, Eric, et al. · Underline Science Inc.

Synthesis and Processing of PPTA in Ionic Liquids

2017 · Sven Dewilde

Ionic liquids as solvents for the synthesis of aramids

2014 · Sven Dewilde, Koen Binnemans, et al. · Lirias

PDF

ALD Barrier Deposition on Porous Low-k Dielectric Materials for Interconnects

2011 · Sven Van Elshocht, Annelies Delabie, et al. · ECS Meeting Abstracts

PDF

Works count: 24

Citation count: 341

H-index: 10

I10-index: 10