Author

Koen De Munck

Observed names: De Munck, Koen, K De Munck, K. De Munck, Koen Munck, Koen de Munck

Institution: IMEC

Observed institutions: IMEC, KU Leuven

OpenAlex ID: A5032184243

3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias

2006 · B. Swinnen, W. Ruythooren, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 192

The RELAXd project: Development of four-side tilable photon-counting imagers

2008 · Zdenek Vykydal, Jan Visschers, et al. · Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment · 42

Process induced sub-surface damage in mechanically ground silicon wafers

2008 · Yu Yang, Koen De Munck, et al. · Semiconductor Science and Technology · 38

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Development of vertical and tapered via etch for 3D through wafer interconnect technology

2006 · Deniz Tezcan, Koen Munck, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 37

Enhanced time delay integration imaging using embedded CCD in CMOS technology

2014 · Piet De Moor, Jo Robbelein, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 33

A Backside-Illuminated Charge-Focusing Silicon SPAD With Enhanced Near-Infrared Sensitivity

2022 · Edward Van Sieleghem, Gauri Karve, et al. · IEEE Transactions on Electron Devices · 27

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High density 20μm pitch CuSn microbump process for high-end 3D applications

2011 · J. De Vos, A. Jourdain, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 23

High performance Hybrid and Monolithic Backside Thinned CMOS Imagers realized using a new integration process

2006 · Koen De Munck, Deniz Sabuncuoglu Tezcan, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 23

Influence of Extreme Thinning on 130-nm Standard CMOS Devices for 3-D Integration

2008 · K. De Munck, T. Chiarella, et al. · IEEE Electron Device Letters · 18

Stress Analysis on Ultra Thin Ground Wafers

2020 · Ricardo C. Teixeira, Koen De Munck, et al. · Journal of Integrated Circuits and Systems · 14

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Backside illuminated thinned CMOS image sensors for space imaging

2008 · K Minoglou, K. De Munck, et al. · Proceedings of IEEE Sensors/Proceedings of IEEE Sensors ... · 14

Edgeless silicon sensors for Medipix-based large-area X-ray imaging detectors

2011 · M J Bosma, J Visser, et al. · Journal of Instrumentation · 13

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Development of Gated Pinned Avalanche Photodiode Pixels for High-Speed Low-Light Imaging

2016 · Tomislav Resetar, Koen De Munck, et al. · Sensors · 12

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Backside Illuminated Hybrid FPA achieving Low Cross-Talk combined with High QE

2024 · Koen De Munck, Padmakumar Rao Ramachandra, et al. · IISS online library · 11

Prototype TDI sensors in embedded CCD in CMOS technology

2024 · Alper Ercan, Luc Haspeslagh, et al. · IISS online library · 11

Quantum efficiency and dark current evaluation of a backside illuminated CMOS image sensor

2015 · Bart Vereecke, Celso Cavaco, et al. · Japanese Journal of Applied Physics · 11

Reduction of Electrical Crosstalk in Hybrid Backside Illuminated CMOS Imagers using Deep Trench Isolation

2008 · Kyriaki Minoglou, Koen de Munck, et al. · IEEE International Interconnect Technology Conference (IITC) · 11

Wafer level temporary bonding/debonding for thin wafer handling applications

2006 · Koen De Munck, Lieve Bogaerts, et al. · 11

Grinding and Mixed Silicon Copper CMP of Stacked Patterned Wafers for 3D Integration

2006 · Koen De Munck, Jan Vaes, et al. · MRS Proceedings · 9

High-end CMOS active pixel sensor for hyperspectral imaging

2005 · Jan Bogaerts, B. Dierickx, et al. · 9

Development of a Si:As blocked impurity band detector for far IR detection

2007 · Deniz S. Tezcan, Jan Putzeys, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 7

Cold performance tests of blocked-impurity-band Si:As detectors developed for DARWIN

2008 · Stephan M. Birkmann, Jutta Stegmaier, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 6

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Backside thinned CMOS imagers with high broadband quantum efficiency realised using new integration process

2007 · K. De Munck, J. Bogaerts, et al. · Electronics Letters · 6

Thickness Characterization of Ultra Thin Wafers on Carrier

2007 · R. C. Teixeira, K. De Munck, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 6

An Integration Time Prediction Based Algorithm for Wide Dynamic Range 3D-Stacked Image Sensors

2024 · Adi Xhakoni, David San Segundo Bello, et al. · Lirias · 5

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Works count: 54

Citation count: 628

H-index: 12

I10-index: 18