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Lanxian Cheng

Observed names: CHENG Lanxian, L X Cheng, L. Cheng, L. X. Cheng, L.X. Cheng, LanXian Cheng
ORCID: 0000-0002-1612-2534
Observed ORCID: 0000-0002-1612-2534
OpenAlex ID: A5032579007
Effects of joint size and isothermal aging on interfacial IMC growth in Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints
2016 · Z.L. Li, L.X. Cheng, et al. · Journal of Alloys and Compounds · 62
Fatigue life prediction of Package-on-Package stacking assembly under random vibration loading
2017 · Jiang Xia, GuoYuan Li, et al. · Microelectronics Reliability · 54
Comparison of fatigue life prediction methods for solder joints under random vibration loading
2019 · Jiang Xia, Lin Yang, et al. · Microelectronics Reliability · 40
Size effect on IMC growth in micro-scale Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints in reflow process
2016 · Z.L. Li, G.Y. Li, et al. · Journal of Alloys and Compounds · 31
Reliability study of package-on-package stacking assembly under vibration loading
2017 · Jiang Xia, LanXian Cheng, et al. · Microelectronics Reliability · 27
Effects of active element Ti on interfacial microstructure and bonding strength of SiO2/ SiO2 joints soldered using Sn3.5Ag4Ti(Ce,Ga) alloy filler
2016 · L.X. Cheng, M.R. Liu, et al. · Materials Science and Engineering A · 24
Effects of titanium on active bonding between Sn3.5Ag4Ti(Ce,Ga) alloy filler and alumina
2015 · L. X. Cheng, G. Y. Li, et al. · Journal of Materials Science Materials in Electronics · 23
Optimal Design for Vibration Reliability of Package-on-Package Assembly Using FEA and Taguchi Method
2016 · Jiang Xia, GuoYuan Li, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 22
Effect of nano-TiO2 addition on microstructural evolution of small solder joints
2016 · Z. L. Li, G. Y. Li, et al. · Journal of Materials Science Materials in Electronics · 16
Influence of active element Ti on interfacial reaction and soldering strength between Sn3.5Ag4Ti(Ce,Ga) alloy filler and Si substrate
2016 · L.X. Cheng, G.Y. Li, et al. · Materials Science and Engineering A · 14
Active element Ti improves the Sn-based alloy filler/graphite soldering interface: A combined first-principles and experimental study
2024 · Zhencheng Yang, Lanxian Cheng, et al. · Materials Science in Semiconductor Processing · 9
CE-PBFT: An Optimized PBFT Consensus Algorithm for Microgrid Power Trading
2024 · Xu Ding, Haihua Lu, et al. · Electronics · 8
Study on the Electrothermal Properties of Cu-CNT TSV Interconnects Under Multiphysics Field Coupling
2024 · Canqing Li, Zhuoming Liang, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 5
Microstructure regulation of Sn-3.0Ag-0.5Cu micro-solder joints by hybridizing nano-TiO2
2022 · Zhenlong Li, Lanxian Cheng, et al. · Microelectronics Reliability · 5
Adsorption and interface reaction in direct active bonding of GaAs to GaAs using Sn–Ag–Ti solder filler
2021 · L. X. Cheng, X. J. Yue, et al. · Journal of Materials Science Materials in Electronics · 3
Terahertz (THz) Metasurface Switch by Phase Change Medium
2019 · Guanting Cen, Honglang Deng, et al. · IEEE MTT-S International Wireless Symposium (IWS) · 3
A novel low temperature active bonding of Si/Si with Sn3.5Ag4Ti(Ce,Ga) alloy filler
2015 · L.X. Cheng, G.Y. Li, et al. · Materials Letters · 3
Deformation Mechanism in Ti–6Al–4V Seamless Tube with Microstructure Formed upon Continuous Cooling to Two-Phase Region
2025 · Y. Han, E. T. Dong, et al. · The Physics of Metals and Metallography · 2
Rotor Position Estimation Algorithm for Surface-Mounted Permanent Magnet Synchronous Motor Based on Improved Super-Twisting Sliding Mode Observer
2025 · Zhuoming Liang, Lanxian Cheng, et al. · Electronics · 2
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Role of Ti in direct active bonding of SiC substrate using Sn–Ag–Ti alloy filler
2022 · L. X. Cheng, K. B. Ma, et al. · Journal of Materials Science Materials in Electronics · 2
PoP assembly reliability test and assessment under random vibration loading
2016 · Jiang Xia, GuoYuan Li, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2
Low Temperature Active Bonding Mechanism of Sn3.5Ag4Ti (Ce,Ga) Alloy Filler with SiC Substrates
2020 · Kaibin Ma, Lanxian Cheng, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 1
Study on Current Sharing of SiC MOSFETs Multi‐Chip Parallel Based on Self‐Inductance and Mutual Inductance Coupling
2026 · Haihua Lu, Lanxian Cheng, et al. · IEEJ Transactions on Electrical and Electronic Engineering
Influence of Titanium on Low Temperature Active Bonding of Quartz Glass with Bi42Sn2Ag2Ti(Ce,Ga) Alloy Filler
2020 · Dongyuan Chen, Lanxian Cheng, et al. · International Conference on Electronic Packaging Technology (ICEPT)
Effects of active adsorption on thermodynamic equilibrium of solid-liquid interface
2020 · L X Cheng, B H Yan, et al. · IOP Conference Series Materials Science and Engineering
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Works count: 27
Citation count: 358
H-index: 10
I10-index: 10
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