Author

Bin Yang

2019 · Bin Yang, Cheng Wang, et al. · IEEE Communications Letters · 13
2018 · Hongmei Li, Yu Wang, et al. · IEEE Access · 11
2018 · Bin Yang, Hongmei Li, et al. · International Journal of Applied Electromagnetics and Mechanics · 5
2018 · Hongmei Li, Fuchen Zhang, et al. · International Journal of Applied Electromagnetics and Mechanics · 4
2016 · Yang Bin, Qingwen Han, et al. · Journal of Chongqing Institute of Technology · 3
2019 · B Yang, B Yang, et al. · Journal of Physics Conference Series · 2
2021 · Li Jianqi, Zhang Zhe, et al. · Information Communication Technologies Conference (ICTC) · 1
2010 · Abdelhak Zoubir, Mats Viberg, et al. · Signal Processing · 1
2024 · Xiangping Niu, Fuchen Zhang, et al. · Insight - Non-Destructive Testing and Condition Monitoring
2018 · Bo Hu, Chen Zhimou, et al. · Bulletin of Surveying and Mapping
2011 · Yang Bin · Journal of Chengdu University of Information Technology
2006 · Yang Bin · Journal of Solid Rocket Technology
2006 · Yang Bin · Telecommunication Engineering
2005 · Yang Bin · Journal of Chongqing University of Posts and Telecommunications
Works count: 22
Citation count: 67
H-index: 4
I10-index: 3
Year
Topic
Type