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Bryan Christian S. Bacquian

Observed names: B. Bacquian, B. C. Bacquian, Bacquian, Bryan Christian S., Bryan Christian Bacquian
OpenAlex ID: A5032935322
A Study of Wafer Backgrinding Tape Selection for SOI Wafers
2019 · Bryan Christian S. Bacquian, Frederick Ray I. Gomez · Journal of Engineering Research and Reports · 8
Bond Line Thickness Characterization for QFN Package Robustness
2020 · Bryan Christian S. Bacquian, Edwin M. Graycochea Jr, et al. · Journal of Engineering Research and Reports · 5
Dicing before Grinding: A Robust Wafer Thinning and Dicing Technology
2020 · Bryan Christian S. Bacquian · Journal of Engineering Research and Reports · 5
Process Enhancement to Eliminate Adhesive Film Remains during Die Picking
2020 · E. Graycochea Jr., B. C. Bacquian, et al. · Journal of Engineering Research and Reports · 4
Backside Chippings Improvement through Wafer Dicing Parameter Optimization and Understanding the Anistropic Silicon Properties
2021 · Aiza Marie E. Agudon, Bryan Christian S. Bacquian · Journal of Engineering Research and Reports · 3
A Study of Dispense Needle for Die Attach Voids Mitigation
2020 · R. Rodriguez, B. C. Bacquian, et al. · Journal of Engineering Research and Reports · 3
Introduction of Laser Pi-Grooving as Breakthrough Solution to Enhance die Strength of 40 nm ulow-k CMOS Silicon Technology during Wafer Saw Process
2021 · Aiza Marie E. Agudon, Hynlie B. Inguin, et al. · Journal of Engineering Research and Reports · 2
Die Attach Process Defect Mitigation through Design Improvement on Anvil Block Tooling
2020 · Rennier S. Rodriguez, Frederick Ray I. Gomez, et al. · Journal of Engineering Research and Reports · 2
Die Attach Process Analysis of Enhanced Stand-off Stopper on Tapeless Leadframe
2020 · E. Graycochea Jr., F. Gomez, et al. · Journal of Engineering Research and Reports · 2
Wafer Preparation Parameter Optimization for Wafer Defects Elimination
2020 · B. C. Bacquian, F. R. Gomez · Journal of Engineering Research and Reports · 2
A Study of Vacuum Efficiency for Silicon on Insulator Wafers
2019 · Bryan Christian S. Bacquian, Frederick Ray I. Gomez · Journal of Engineering Research and Reports · 2
Wirebond enhancement on copper palladium bonding in a Over Pad Metalization
2014 · Michael B. Tabiera, Bryan Christian S. Bacquian, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 2
Laser DAF Cut: A Breakthrough Approach of Die Attach Film Singulation for Thin Wafers
2021 · Aiza Marie E. Agudon, Frederick P. Arellano, et al. · Journal of Engineering Research and Reports · 1
Package Reliability Performance Study of QFN Device on Different Die Attach Machines
2020 · Edwin Graycochea Jr., Rennier Rodriguez, et al. · Journal of Engineering Research and Reports · 1
Ball Misplace Mitigation through Process Optimization of Advanced Leadframe Package
2020 · Bryan Christian S. Bacquian, Frederick Ray I. Gomez, et al. · Journal of Engineering Research and Reports · 1
A Study of Die Shear Test Performance on Different Diebond Machine Platforms
2020 · B. C. Bacquian, R. Rodriguez, et al. · Journal of Engineering Research and Reports · 1
A Study of the Effect of Back Grind Wheels on Wafer Edge Chippings and Die Strength
2020 · Bryan Christian S. Bacquian · Journal of Engineering Research and Reports · 1
Addressing Off-Centered Ball through Solder Paste Material Evaluation
2020 · B. C. Bacquian, F. R. Gomez, et al. · Journal of Engineering Research and Reports
Multi-Hole Process Plate Modification for Chip on Lead Device at Die Attach Process
2020 · E. Graycochea Jr., R. Rodriguez, et al. · Journal of Engineering Research and Reports
Die Attach Film Bleed out Resolution through Process Optimization on DFN Packages
2020 · Bryan Christian S. Bacquian, Edwin M. Graycochea Jr., et al. · Journal of Engineering Research and Reports
Die Attach Machine Selection for Glue Voids Reduction Performance
2020 · Edwin Graycochea Jr., Rennier Rodriguez, et al. · Journal of Engineering Research and Reports
Effect of Backgrinding Tape Lamination on Die Alignment
2020 · Bryan Christian Bacquian, Frederick Ray Gomez · Journal of Engineering Research and Reports
Mitigating Wafer Edge Cut Defect through Tensionless Tape Lamination Technique
2020 · Bryan Christian S. Bacquian, Frederick Ray I. Gomez · Journal of Engineering Research and Reports
Wafer Saw Process Optimization for Die Chipping Mitigation on Extremely Small Leadframe Package
2020 · A. Sumagpang Jr., F. R. Gomez, et al. · Journal of Engineering Research and Reports
Improved Chuck Table Design for Silicon Wafer Defects Resolution
2020 · Bryan Christian Bacquian, Frederick Ray Gomez · Journal of Engineering Research and Reports
Works count: 58
Citation count: 45
H-index: 4
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