Author

Jong-Bum Lee

Observed names: JONG-BUM LEE, Jongbum Lee

Observed institutions: Kookmin University, Agency for Science, Technology and Research, Sangmyung University, Chungbuk National University, Singapore Science Park, Dong-A University Hospital, Institute of Microelectronics, Kumho Petrochemical (South Korea), Samsung Electronics (South Korea), Dong-A University, Yeungnam University, Wonkwang University, Sungkyunkwan University

OpenAlex ID: A5032953122

Effect of surface finish material on printed circuit board for electrochemical migration

2007 · Bo-In Noh, Jong-Bum Lee, et al. · Microelectronics Reliability · 77

Reliability Investigation of Cu/In TLP Bonding

2014 · Jong-Bum Lee, How-Yuan Hwang, et al. · Journal of Electronic Materials · 59

Mechanical and Electrical Properties of Cu/Sn-3.5Ag/Cu Ball Grid Array (BGA) Solder Joints after Multiple Reflows

2007 · Ja-Myeong Koo, Bui Quoc Vu, et al. · Journal of Electronic Materials · 18

A Study on the Characteristics of Vibration in Seat System

2003 · Sungshik Baik, Jongbum Lee, et al. · SAE technical papers on CD-ROM/SAE technical paper series · 18

Reliability of Au bump flip chip packages with adhesive materials using four-point bending test

2009 · Bo-In Noh, Jeong-Won Yoon, et al. · International Journal of Adhesion and Adhesives · 13

Unimodular Groups of Type ℝ3⋊ ℝ

2007 · Jong-Bum Lee, Kyung-Bai Lee, et al. · Journal of the Korean Mathematical Society · 10

PDF

28.7 A 1.1V 6.4Gb/s/pin 24-Gb DDR5 SDRAM with a Highly-Accurate Duty Corrector and NBTI-Tolerant DLL

2023 · Daehyun Kwon, Heon Su Jeong, et al. · Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference · 9

The influence of MWNT composite on the stretchability of conductive nanopaste screen-printed on elastomeric substrate

2012 · Kwang-Seok Kim, Quoc Vu Bui, et al. · Current Applied Physics · 9

Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards

2008 · Jong-Bum Lee, Ja-Myeong Koo, et al. · Japanese Journal of Applied Physics · 9

Effect of Atmospheric Pressure Plasma Treatment on Transverse Ultrasonic Bonding of Gold Flip-Chip Bump on Glass Substrate

2008 · Ja-Myeong Koo, Jung-Lae Jo, et al. · Japanese Journal of Applied Physics · 9

The Validity and Reliability of 'Computerized Neurocognitive Function Test' in the Elementary School Child

2003 · Jong-Bum Lee, Jin Sung Kim, et al. · 9

Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders

2011 · Jeong-Won Yoon, Jong-Gun Lee, et al. · Journal of Materials Science Materials in Electronics · 8

Career education in South Korea: Current status and Future direction

2015 · Chyul-Young Jyung, Jeong Jin-Chul, et al. · 7

Evaluation of Die-Attach Bonding Using High-Frequency Ultrasonic Energy for High-Temperature Application

2014 · Jong-Bum Lee, Jie-Li Aw, et al. · Journal of Electronic Materials · 4

PDF

Reliability of Fine-Pitch Flip-Chip (COG) Bonding with Non-Conductive Film Using Ultrasonic Energy

2010 · Jung-Lae Jo, Jong-Bum Lee, et al. · The Journal of Adhesion · 4

Text Mining Analysis of Practical Arts Curriculum Using R

2017 · Jung Park, Wan-Sup Cho, et al. · 3

The Effect of Vocation Experience Activity on Elementary School Students' Career Development,Academic Motive, Creativity and Sociality

2012 · Chyul-Young Jyung, Kim Bong-Whan, et al. · 3

Thermo-compression bonding of electrodes between FPCB and RPCB

2010 · Jeong-Won Yoon, Jin-Kyu Jang, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 3

Failure Behaviors of Flip Chip Solder Joints Under Various Loading Conditions of High-speed Shear Test

2009 · SANG-SU HA, SANG-OK HA, et al. · International Journal of Modern Physics B · 3

Drop reliability evaluation of Sn-3.0Ag-0.5Cu solder joint with OSP and ENIG surface finishes

2009 · Sang-Ok Ha, Sang-Su Ha, et al. · Journal of the Microelectronics and Packaging Society · 3

Characteristic of Underfill with Various Epoxy Resin

2006 · Bo‐In Noh, Jong-Bum Lee, et al. · Journal of the Microelectronics and Packaging Society · 3

A Daily Operation Scheduling of Cogeneration System with a Thermal Storage Tank

1994 · Jong-Bum Lee, Seung-Heon Lyu, et al. · IEEJ Transactions on Power and Energy · 3

PDF

Effect of Different Surface Finishes on Bending Reliability of the Rigid Printed Circuit Board and Flexible Printed Circuit Board Substrate Joints with the Transverse Ultrasonic Bonding Process

2019 · Jong Gun Lee, Jong-Bum Lee, et al. · Nanoscience and Nanotechnology Letters · 2

Text Network Analysis of High School Career and Vocation Curriculum

2018 · Jung Park, Jinhyuk Kim, et al. · 진로교육연구 · 2

Reliability of Cu-Cu direct interconnections using ultrasonic bonding process between RPCB and FPCB

2011 · Jong-Bum Lee, Woo‐Ram Myung, et al. · 2

Works count: 96

Citation count: 310

H-index: 9

I10-index: 6