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Simon Althoff

Observed names: Althoff, Simon, S. Althoff
ORCID: 0000-0003-2207-7220
Observed ORCID: 0000-0003-2207-7220
OpenAlex ID: A5033304370
Configuration Solution for TSN-based Industrial Networks utilizing SDN and OPC UA
2020 · Thomas Kobzan, Immanuel Blocher, et al. · IEEE International Conference on Emerging Technologies and Factory Automation (ETFA) · 33
Secure and Time-sensitive Communication for Remote Process Control and Monitoring
2018 · Thomas Kobzan, Sebastian Schriegel, et al. · IEEE International Conference on Emerging Technologies and Factory Automation (ETFA) · 26
Modeling of the stick-slip effect in heavy copper wire bonding to determine and reduce tool wear
2015 · Andreas Unger, Walter Sextro, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 18
Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding
2014 · Andreas Unger, Walter Sextro, et al. · 16
Improving the bond quality of copper wire bonds using a friction model approach
2014 · Simon Althoff, Jan Neuhaus, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 15
Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process
2016 · Florian Eacock, Andreas Unger, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 14
Influences of bonding parameters on the tool wear for copper wire bonding
2013 · Paul Eichwald, Walter Sextro, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 13
Experimental and Numerical Simulation Study of Pre-deformed Heavy Copper Wire Wedge Bonds
2014 · Andreas Unger, Walter Sextro, et al. · IMAPSource Proceedings · 12
Modeling and simulation of the ultrasonic wire bonding process
2015 · Tobias Meyer, Andreas Unger, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 11
Validated simulation of the ultrasonic wire bonding process
2016 · Andreas Unger, Reinhard Schemmel, et al. · IEEE CPMT Symposium Japan (ICSJ) · 10
A friction based approach for modeling wire bonding
2013 · Simon Althoff, Jan Neuhaus, et al. · IMAPSource Proceedings · 10
A Process to Develop Lean Big-Data Platform Architectures for Industrial Manufacturing Contexts
2020 · Marvin Illian, Simon Althoff, et al. · IEEE International Conference on Emerging Technologies and Factory Automation (ETFA) · 8
Shape-Dependent Transmittable Tangential Force of Wire Bond Tools
2016 · Simon Althoff, Tobias Meyer, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 8
Improving the cleaning process in copper wire bonding by adapting bonding parameters
2015 · Simon Althoff, Andreas Unger, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 8
Analysis method of tool topography change and identification of wear indicators for heavy copper wire wedge bonding
2014 · Paul Eichwald, Walter Sextro, et al. · IMAPSource Proceedings · 8
Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation
2016 · Tobias Meyer, Andreas Unger, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7
Effects of different working frequencies on the joint formation in copper wire bonding
2018 · Reinhard Schemmel, Simon Althoff, et al. · 6
Micro wear modeling in copper wire wedge bonding
2016 · Paul Eichwald, Andreas Unger, et al. · IEEE CPMT Symposium Japan (ICSJ) · 6
Towards an Autonomous Application of Smart Services in Industry 4.0
2021 · Magnus Redeker, Christian Klarhorst, et al. · IEEE International Conference on Emerging Technologies and Factory Automation (ETFA) · 5
Microstructural investigations of aluminum and copper wire bonds
2014 · Florian Eacock, Mirko Schaper, et al. · IMAPSource Proceedings · 4
Towards a One-Stop-Shop Solution for the Application of Data-Driven Value-Adding Services in Production
2024 · Magnus Redeker, Dennis Quirin, et al. · IEEE International Conference on Emerging Technologies and Factory Automation (ETFA) · 2
Plug&Produce durch Software-defined Networking
2020 · Thomas Kobzan, Alexander Boschmann, et al. · Technologien für die intelligente Automation · 2
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Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design
2017 · Paul Eichwald, Simon Althoff, et al. · IMAPSource Proceedings · 2
Analysis of bidirectional EV charging infrastructures within industrial DC grids
2026 · Henning Rahlf, Lukas Knorr, et al. · Smart Energy · 1
Konzept und Implementierung einer kommunikationsgetriebenen Verwaltungsschale auf effizienten Geräten in Industrie 4.0 Kommunikationssystemen
2022 · Immanuel Blöcher, Simon Althoff, et al. · Technologien für die intelligente Automation · 1
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Works count: 36
Citation count: 247
H-index: 10
I10-index: 11
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