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Debika Chaudhuri
Observed names:
D. Chaudhuri,
D. Ray Chaudhuri
Institutions:
IFTM University,
Indian Institute of Engineering Science and Technology, Shibpur
Observed institutions:
IFTM University,
Indian Institute of Information Technology Kalyani,
Indian Institute of Engineering Science and Technology, Shibpur
ORCID:
0000-0002-9026-3191
Observed ORCID:
0000-0002-9026-3191
OpenAlex ID:
A5033471605
Comparison of Different SRAM Cell Topologies Using 180 nm Technology
2019
·
D. Chaudhuri
, Kousik Roy
, et al.
·
Lecture notes in networks and systems
·
8
Heat Mitigation in 3D ICs by Improvised TTSV Structure
2020
·
Debika Chaudhuri
, Dalia Nandi Das
, et al.
·
International Symposium on Devices, Circuits and Systems (ISDCS)
·
7
Modeling and Analysis of 3D IC Structures for Heat Mitigation by Thermal Through Silicon Vias
2020
·
Debika Chaudhuri
, Dalia Nandi Das
, et al.
·
IEEE International Conference on Industrial and Information Systems (ICIIS)
·
2
Low Power Full Adder Circuit ImplementedIn Different Logic
2014
·
Debika Chaudhuri
, Atanu Nag
, et al.
·
International Journal of Innovative Research in Science Engineering and Technology
·
1
A Power Efficient Binary Multiplier Circuit with Overflow Detection Using Single Spin Logic Circuit: Design and Implementation
2009
·
Ankush Ghosh
, Souvik Sarkar
, et al.
·
Advanced Science Letters
·
1
Graphene-based TSVs with BCB liner and p + guard ring: a paradigm for ultra-low noise 3D ICs
2026
·
Debika Chaudhuri
, Hafizur Rahaman
, et al.
·
Journal of Computational Electronics
Smart Bioactive Systems Driven by Nanotechnology: Innovations in Healthcare and Beyond
2026
·
Atanu Nag
, Debika Chaudhuri
·
IGI Global eBooks
Sustainable Land Management With Geospatial AI
2026
·
Atanu Nag
, Debika Chaudhuri
·
Advances in geospatial technologies book series
Precision Agriculture and Crop Monitoring With Geospatial AI
2026
·
Debika Chaudhuri
, Atanu Nag
·
Advances in geospatial technologies book series
A novel approach for performance improvements of TSV and TTSV of 3D IC through thermoelectric effect and mechanical reliability analysis
2026
·
Debika Chaudhuri
, Hafizur Rahaman
, et al.
·
Sadhana
Thermo-electro-mechanical Effects of Copper TSV Interconnects on the MOS Characteristics in Stacked 3D Integration
2024
·
Debika Chaudhuri
, Rashid Jamal
, et al.
·
Lecture notes in networks and systems
A Novel Approach to Model and Analyze Wafer–Wafer Hybrid Bonding
2023
·
Debika Chaudhuri
, Hafizur Rahaman
, et al.
·
Lecture notes in electrical engineering
Comparative Analysis of Performance of 7- Segment Display Using Different Low Power VLSI Designs
2014
·
Rajdeep Chahal
, Pritam Barua
, et al.
Implementation of a Low Power Carry LookAhead Adder Using Adiabetic Logic
2014
·
Debika Chaudhuri
, Atanu Nag
, et al.
·
International Journal of Innovative Research in Science Engineering and Technology
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Works count:
14
Citation count:
19
H-index:
2
I10-index:
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