Author

Mukunda Khanal

Institution: Lamar University

Observed institution: Lamar University

ORCID: 0000-0002-5192-1868

Observed ORCID: 0000-0002-5192-1868

OpenAlex ID: A5033617910

Tribocorrosion Behavior of Micro/Nanoscale Surface Coatings

2022 · Md Ashraful Hoque, Chun-Wei Yao, et al. · Sensors · 33

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Effect of Stiffening the Printed Circuit Board in the Fatigue Life of the Solder Joint

2022 · Sushil Doranga, Matthew Schuldt, et al. · Materials · 24

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Thermal Stresses in a Bi-Layer Assembly in Electronics Packaging

2023 · Mathews T Vellukunnel, Mukunda Khanal, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 12

Removing Acidic Yellow Dye from Wastewater Using Moringa Peregrina

2022 · Negar Saraei, Mukunda Khanal, et al. · Computational Research Progress in Applied Science and Engineering · 9

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System Identification and Dynamic Analysis of the Propulsion Shaft Systems Using Response Surface Optimization Technique

2024 · Aavash Chandra Paudel, Sushil Doranga, et al. · Applied Mechanics · 8

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A novel approach of fatigue testing and evaluation of electronic systems based on phase tracking

2024 · Sushil Doranga, Sima Besharat Ferdowsi, et al. · Microelectronics Reliability · 7

Effect of green synthesized zinc oxide nanoadditives and rice bran oil biodiesel blend on performance and combustion characteristics of a variable compression ratio diesel engine: an experimental study

2023 · Manish Koirala, Amit Kumar Sah, et al. · Biofuels Bioproducts and Biorefining · 7

Analytical Solution for Moisture Diffusion with Initial Non-Uniform Moisture Concentration used in Bake Time Study in Electronics Packaging

2023 · Mukunda Khanal, Jiang Zhou, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 4

Accurate Prediction of Solder Stresses/Strains in Multi-Layered Electronics Packages During Temperature Cycling

2024 · Mukunda Khanal, Jenny Zhou, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2

Laboratory and Field Test Equipment for Optimization of the Asphalt Pavement

2022 · Mukunda Khanal, Nischal Kharel, et al. · Computational Research Progress in Applied Science and Engineering · 1

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Investigating the Impact of Dynamic Excitation and Boundary Conditions on the Fatigue Life of Board-Level Electronic Packages

2026 · Sima Besharat Ferdowsi, Sushil Doranga, et al. · Journal of Electronic Packaging

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Works count: 11

Citation count: 107

H-index: 7

I10-index: 3