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Chingfu Tsou

Observed names: C Tsou, C. Tsou, C.T. Tsou, ChingFu Tsou, Tsou, Chingfu
ORCID: 0000-0002-1466-9982
Observed ORCID: 0000-0002-1466-9982
OpenAlex ID: A5034138771
Silicon-Based Packaging Platform for Light-Emitting Diode
2006 · C.T. Tsou, Y.-S. Huang · IEEE Transactions on Advanced Packaging · 79
The implementation of a thermal bubble actuated microfluidic chip with microvalve, micropump and micromixer
2014 · Chenghan Huang, Chingfu Tsou · Sensors and Actuators A Physical · 68
A novel self-aligned vertical electrostatic combdrives actuator for scanning micromirrors
2005 · C Tsou, W T Lin, et al. · Journal of Micromechanics and Microengineering · 33
On the Determination of Thermal Expansion Coefficient of Thermal Oxide
2005 · Chingfu Tsou, Y.-S. Huang, et al. · TechConnect Briefs · 26
A Silicon-Based LED Packaging Substrate With an Island Structure for Phosphor Encapsulation Shaping
2014 · Yukuan Chu, Chunyu Chen, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 20
Design and fabrication of acoustic wave actuated microgenerator for portable electronic devices
2008 · Tenghsien Lai, Changhan Huang, et al. · Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS · 20
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Characterization study of time- and temperature-dependent mechanical behavior of polyimide materials in electronic packaging applications
2005 · Chia-Tai Kuo, Ming-Chuen Yip, et al. · Journal of Electronic Materials · 19
A Novel Silicon-Based LED Packaging Module With an Integrated Temperature Sensor
2014 · Shengwei Chang, Chingfu Tsou · IEEE Transactions on Components Packaging and Manufacturing Technology · 18
Optically Driven Mobile Integrated Micro-Tools for a Lab-on-a-Chip
2013 · Yi-Jui Liu, Yi-Hsiung Lee, et al. · Actuators · 15
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On the out-of-plane deformation of V-shaped micromachined beams
2001 · ChingFu Tsou, Honglin Yin, et al. · Journal of Micromechanics and Microengineering · 14
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Novel Silicon-Based LED Packaging Module With an Integrated Photosensing Element
2013 · Kuochun Tseng, Chingfu Tsou · IEEE Photonics Technology Letters · 13
A Novel Wafer-Level Hermetic Packaging for MEMS Devices
2007 · Chingfu Tsou, Hungchung Li, et al. · IEEE Transactions on Advanced Packaging · 13
Silicon-based Packaging Platform for Light Emitting Diode
2006 · C. Tsou, Y.S. Huang, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 13
A Monolithic Micromachined Thermocouple Probe With Electroplating Nickel for Micro-LED Inspection
2021 · Fuchi Shih, Chingfu Tsou, et al. · Journal of Microelectromechanical Systems · 12
A novel sensing chip with dual-coil inductance for determining raw milk quality
2016 · Weichen Li, Siansyun Liao, et al. · Sensors and Actuators A Physical · 11
Measuring thin film elastic modulus using a micromachined cantilever bending test by nanoindenter
2007 · Changchun Hsu, Chingfu Tsou, et al. · Journal of Micro/Nanopatterning Materials and Metrology · 11
A New Method for Microlens Fabrication by a Heating Encapsulated Air Process
2006 · Chingfu Tsou, Chewei Lin · IEEE Photonics Technology Letters · 10
Electroplated nickel micromachined probes with out-of-plane predeformation for IC chip testing
2006 · Chingfu Tsou, Shuen-Lung Huang, et al. · Journal of Micromechanics and Microengineering · 10
Silicon-based Packaging Platform with Embedded Solder Interconnections for Light Emitting Diode
2006 · Chingfu Tsou, Yu-Sheng Huang, et al. · Journal of Physics Conference Series · 10
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Micro-Cantilever Array With Electroplating Tin Bumps for Flip-Chip Bonding Technology
2023 · Zihsong Hu, Chengshiun Liou, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 9
Lens Sag Measurement of Microlens Array Using Optical Interferometric Microscope
2011 · Shih-Wei Yang, Chern-Sheng Lin, et al. · Optics Communications · 9
Automatic inspection of the width and gap of etching transistors in TFT-LCD panels using sub-pixel accuracy estimation
2006 · Chern-Sheng Lin, Chia-Wen Tsai, et al. · The International Journal of Advanced Manufacturing Technology · 9
A self-aligned fabrication method of dual comb drive using multilayers SOI process for optical MEMS applications
2005 · W. T. Lin, J. C. Chiou, et al. · Microsystem Technologies · 9
HBV infection increases the risk of macular degeneration: the roles of HBx-mediated sensitization of retinal pigment epithelial cells to UV and blue light irradiation
2018 · Ruey-Hwang Chou, Chang-Yin Lee, et al. · Journal of Translational Medicine · 8
Thermal Bubble Microfluidic Gate Based on SOI Wafer
2009 · Chingfu Tsou, Chenghan Huang · Journal of Microelectromechanical Systems · 8
Works count: 79
Citation count: 590
H-index: 13
I10-index: 19
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