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Joshua Adeniyi Depiver

Observed names: Depiver, Joshua, Joshu Depiver, Joshua A Depiver, Joshua A. Depiver, Joshua Depiver, Joshua Depriver, Joshua a Depiver
ORCID: 0000-0001-8773-2535
Observed ORCID: 0000-0001-8773-2535
OpenAlex ID: A5034594145
Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions
2021 · Joshua A. Depiver, Sabuj Mallik, et al. · Engineering Failure Analysis · 138
Solder joint failures under thermo-mechanical loading conditions – A review
2020 · Joshua a Depiver, Sabuj Mallik, et al. · Advances in Materials and Processing Technologies · 79
Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB)
2020 · Joshua A. Depiver, Sabuj Mallik, et al. · Journal of Electronic Materials · 65
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Effect of Creep, Fatigue and Random Vibration on the Integrity of Solder Joints in BGA Package
2024 · Joshua A. Depiver, Sabuj Mallik, et al. · Microelectronics Reliability · 24
Comparing and Benchmarking Fatigue Behaviours of Various SAC Solders under Thermo-Mechanical Loading
2020 · Joshua Adeniyi Depiver, Sabuj Mallik, et al. · Electronic System-Integration Technology Conference (ESTC) · 24
Characterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packaging
2023 · Joshua A. Depiver, Sabuj Mallik, et al. · Journal of Electronic Materials · 21
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Creep Damage of BGA Solder Interconnects Subjected to Thermal Cycling and Isothermal Ageing
2019 · Joshua A. Depiver, Sabuj Mallik, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 14
An Empirical Study on Convective Drying of Ginger Rhizomes Leveraging Environmental Stress Chambers and Linear Heat Conduction Methodology
2023 · Joshua Adeniyi Depiver, Sabuj Mallik · Agriculture · 10
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Creep response of various solders used in soldering ball grid array (BGA) on printed circuit board (PCB)
2019 · Joshua Adeniyi Depiver, Sabuj Mallik, et al. · University of Derby Online Research Archive. (University of Derby) · 10
Experimental Analysis of Thin Layer Drying of Ginger Rhizome in Convective Environment
2020 · Gbasouzor Austin Ikechukwu, Sabuj Mallik, et al. · Advances in Science Technology and Engineering Systems Journal · 7
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Impact of Thermomechanical Fatigue and Creep on the Reliability of BGA Lead-Free Solder Joints in Electronic Modules
2024 · Joshua A Depiver, Sabuj Mallik, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 5
Thermo-mechanical Reliability Studies of Lead-Free Solder Interconnects
2021 · Depiver, Joshua · University of Derby Online Research Archive. (University of Derby) · 3
Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications
2021 · Joshua A. Depiver, Sabuj Mallik, et al. · Advances in transdisciplinary engineering · 2
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Finite element comparative study on creep and random vibrations of solder joints in BGA package
2025 · Joshua A. Depiver, Sabuj Mallik, et al. · Power Electronic Devices and Components · 1
Comparative Analysis of SAC Solder Alloys for Enhanced Reliability in Electronic Assemblies: A Finite Element Approach
2024 · Joshua Depiver, Sabuj Mallik, et al. · Research Square · 1
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Assessing the Impact of Creep and Random Vibration on BGA Solder Interconnects Through Finite Element Analysis (FEA)
2024 · Joshua Depiver, Sabuj Mallik, et al. · International Spring Seminar on Electronics Technology · 1
Temperature Distribution and Boundary Condition on Heat Transfer from Discretized Element of Dried Ginger Rhizome Using MATLAB PDES for Optimal Preservation
2020 · Austin Ikechukwu Gbasouzor, Joshu Depiver, et al. · Springer eBooks · 1
Hybrid Predictive Model for Thermo-Mechanical Reliability Assessment of Lead-Free Solder Interconnects
2025 · Joshua Adeniyi Depiver, Sabuj Mallik · International Conference on Modeling, Simulation & Intelligent Computing (MoSICom)
The Interplay of Creep Behaviour, Fatigue Failure, and Random Vibration: Implications for Solder Joint Reliability
2023 · Joshua Adeniyi Depiver, Sabuj Mallik, et al. · SSRN Electronic Journal
Works count: 20
Citation count: 406
H-index: 9
I10-index: 9
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