Author

Zhongyu Liu

Institution: Henan University of Technology

Observed institution: Henan University of Technology

ORCID: 0009-0008-3002-1079

Observed ORCID: 0009-0008-3002-1079

OpenAlex ID: A5034755504

Nanostructured compliant interconnections for advanced Micro-Electronic packaging

2024 · Waqas Saeed, Zhongyu Liu, et al. · Materials & Design · 19

Microstructural evolution and mechanical properties of chip-stacking micro-solder joints under TG bonding process

2025 · Ye Tian, Hongsheng Xu, et al. · Journal of Materials Research and Technology · 3

Rapid unidirectional growth of electronic micro-intermetallic interconnects with prismatic grains

2025 · Ye Tian, Rubin Yan, et al. · Materials Characterization · 1

Works count: 3

Citation count: 23

H-index: 2

I10-index: 1