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Alexander Göritz

Observed names: A Goritz, A. Goeritz, A. Goritz, A. Göritz, Alexander Goeritz, Alexander Goritz, Goritz, A., Goritz, Alexander, Göritz, Alexander
ORCID: 0000-0003-2459-5224
Observed ORCID: 0000-0003-2459-5224
OpenAlex ID: A5035482743
Wafer-Scale Fabrication of Recessed-Channel PtSe2 MOSFETs With Low Contact Resistance and Improved Gate Control
2018 · Lei Li, Kuanchen Xiong, et al. · IEEE Transactions on Electron Devices · 45
D–Band RF–MEMS SPDT Switch in a $0.13~\mu$ m SiGe BiCMOS Technology
2016 · Selin Tolunay Wipf, Alexander Goritz, et al. · IEEE Microwave and Wireless Components Letters · 30
Large-Scale Fabrication of Submicrometer-Gate-Length MOSFETs With a Trilayer PtSe2 Channel Grown by Molecular Beam Epitaxy
2020 · Kuanchen Xiong, Maria Hilse, et al. · IEEE Transactions on Electron Devices · 26
A 125–143-GHz Frequency-Reconfigurable BiCMOS Compact LNA Using a Single RF-MEMS Switch
2019 · Julio Heredia, Miquel Ribó, et al. · IEEE Microwave and Wireless Components Letters · 23
CMOS-compatible batch processing of monolayer MoS 2 MOSFETs
2018 · Kuanchen Xiong, Hyun Kim, et al. · Journal of Physics D Applied Physics · 18
Thin film wafer level encapsulated RF-MEMS switch for D-Band applications
2016 · S. Tolunay Wipf, A. Göritz, et al. · European Microwave Integrated Circuits Conference · 16
Perfluorodecyltrichlorosilane-based seed-layer for improved chemical vapour deposition of ultrathin hafnium dioxide films on graphene
2016 · Julia Kitzmann, Alexander Göritz, et al. · Scientific Reports · 16
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High Performance Thermistor Based on Si1−xGex/Si Multi Quantum Wells
2018 · C. Baristiran Kaynak, Y. Yamamoto, et al. · IEEE Electron Device Letters · 12
Single-chip transmit-receive module with a fully integrated differential RF-MEMS antenna switch and a high-voltage generator for F-band radars
2015 · Václav Valenta, Hermann Schumacher, et al. · 12
Cap Fabrication and Transfer Bonding Technology for Hermetic and Quasi Hermetic Wafer Level MEMS Packaging
2020 · Kai Zoschke, Piotr Mackowiak, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 10
240 GHz RF-MEMS switch in a 0.13 μm SiGe BiCMOS Technology
2017 · S. Tolunay Wipf, A. Göritz, et al. · Proceedings of the ... Bipolar/BiCMOS Circuits and Technology Meeting/Proceedings of the ... BipolarBiCMOS Circuits and Technology Meeting · 10
Monolithic Integration of a Wafer-Level Thin-Film Encapsulated mm-Wave RF-MEMS Switch in BEOL of a 130-nm SiGe BiCMOS Technology
2022 · Alexander Göritz, Selin Tolunay Wipf, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 9
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Improvement by Channel Recess of Contact Resistance and Gate Control in Large-Scale Spin-Coated MoS2 MOSFETs
2018 · Kuanchen Xiong, Lei Li, et al. · IEEE Electron Device Letters · 8
Scanning microwave microscopy of buried CMOS interconnect lines with nanometer resolution
2018 · Xin Jin, Kuanchen Xiong, et al. · International Journal of Microwave and Wireless Technologies · 8
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0.13-μm SiGe BiCMOS technology with More-than-Moore modules
2017 · M. Kaynak, M. Wietstruck, et al. · Proceedings of the ... Bipolar/BiCMOS Circuits and Technology Meeting/Proceedings of the ... BipolarBiCMOS Circuits and Technology Meeting · 8
BiCMOS Integrated Microfluidic Packaging by Wafer Bonding for Lab-on-Chip Applications
2017 · Mesut Inac, Matthias Wietstruck, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 8
BEOL modifications of a 130 nm SiGe BiCMOS technology for monolithic integration of thin-film wafer-level encapsulated D-Band RF-MEMS switches
2021 · Alexander Goritz, Selin Tolunay Wipf, et al. · Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) · 7
An Advanced Finite Element Model for BiCMOS Process Oriented Ultra-Thin Wafer Deformation
2021 · Zhibo Cao, Alexander Goritz, et al. · IEEE Transactions on Semiconductor Manufacturing · 6
(Invited) Si1-xGex/Si MQW Based Uncooled Microbolometer Development and Integration into 130 nm BiCMOS Technology
2018 · Canan Baristiran Kaynak, Yuji Yamamoto, et al. · ECS Transactions · 6
Thin film wafer level encapsulated RF-MEMS switch for D-band applications
2016 · S. Tolunay Wipf, A. Göritz, et al. · European Microwave Conference (EuMC) · 6
Miniature Switchable Millimeter-Wave BiCMOS Low-Noise Amplifier at 120/140 GHz Using an HBT Switch
2019 · Julio Heredia, Miquel Ribó, et al. · Micromachines · 5
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Mid-infrared optical characterization of thin SiNx membranes
2019 · M. Stocchi, D. Mencarelli, et al. · Applied Optics · 5
Pixel resistance optimization of a Si0.5Ge0.5/Si MQWs thermistor based on in-situ B doping for microbolometer applications
2018 · Yuji Yamamoto, Alexander Goritz, et al. · 4
Effect of wafer-level silicon cap packaging on BiCMOS embedded RF-MEMS switch performance
2017 · Selin Tolunay Wipf, Alexander Göritz, et al. · IMAPS Nordic Conference on Microelectronics Packaging (NordPac) · 4
Accurate Depth Control of Through-Silicon Vias by Substrate Integrated Etch Stop Layers
2017 · M. Wietstruck, S. Marschmeyer, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 4
Works count: 60
Citation count: 348
H-index: 10
I10-index: 11
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