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Clement Huang

AlGaN/GaN HEMT development targeted for X-band applications
2013 · Walter Wohlmuth, Ming-Hung Weng, et al. · IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems (COMCAS) · 12
GaN technologies for applications from L- to Ka-band
2017 · Yi-Wei Lien, Sheng-Wen Peng, et al. · IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems (COMCAS) · 8
Degradation and failure analysis of Polysilicon Resistor connecting with Tungsten contact and Copper line
2011 · Clement Huang, Mingte Lin, et al. · IEEE International Reliability Physics Symposium proceedings · 7
A unified aging model with recovery effect and its impact on circuit design
2017 · Wai-Kit Lee, Kasa Huang, et al. · International Conference on Simulation of Semiconductor Processes and Devices · 5
Comprehensive Study of Non-Conducting Stress Characteristics in Ultra-Scaled FinFET
2025 · Jun-Yu Huang, Clement Huang, et al. · IEEE International Reliability Physics Symposium proceedings · 3
Pure-play GaN foundry technology for RF applications
2014 · Che-Kai Lin, Jhih-Han Du, et al. · Asia-Pacific Microwave Conference (APMC) · 3
Diffusion ability of Stress Induced Voiding in advanced BEOL copper process
2012 · Clement Huang, James W. Liang, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 3
Low noise, low switch loss 0.25µm E/D pHEMT technology
2011 · Cheng-Guan Yuan, Shuang Liu, et al. · Asia-Pacific Microwave Conference (APMC) · 3
Pure-play GaN foundry technology for 50V applications
2015 · Che-Kai Lin, Fan-Hsiu Huang, et al. · IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems (COMCAS) · 2
The observation of mobile ion of 40nm node by Triangular Voltage Sweep
2014 · Clement Huang, James W. Liang, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 2
Stress Induced Voiding Behavior of Electroplated Copper Thin Films in Highly Scaled Cu/low-k interconnects
2020 · Clement Huang, Alex Juan, et al. · IEEE International Reliability Physics Symposium proceedings · 1
Improvement in Yield and Assurance in Power Performance for Quarter- Micron Optical Gate 8V Power pHEMT Technology
2010 · Cheng-Guan Yuan, Clement Huang, et al. · 1
Comprehensive Reliability Analysis on Advanced CMOS Technology Featuring 2nm Nanosheet FET
2026 · Jen-Hao Lee, Jun-Yu James Huang, et al. · IEEE International Reliability Physics Symposium proceedings
General estimation of Stress Induced Voiding for vias connected to large Cu plate
2011 · Clement Huang, James W. Liang, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Piezoelectric Effect on Al0.35-£_In£_Ga0.65N/GaN Heterostructures
2002 · Jenn-Kai Tsai, Ikai Lo, et al. · APS March Meeting Abstracts
Works count: 15
Citation count: 50
H-index: 4
I10-index: 1
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