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Mehul D. Shroff

Observed names: M Shroff, M. D. Shroff, M. Shroff, M.D. Shroff, Mehul D. Shrof, Mehul Shroff, Shroff, Mehul
Institution: NXP (Germany)
ORCID: 0000-0002-7664-8941
Observed ORCID: 0000-0002-7664-8941
OpenAlex ID: A5036395022
Activation of Precipitated Iron Fischer-Tropsch Synthesis Catalysts
1995 · M.D. Shroff, D.S. Kalakkad, et al. · Journal of Catalysis · 346
Attrition of precipitated iron Fischer-Tropsch catalysts
1995 · Dinesh S. Kalakkad, Mehul D. Shroff, et al. · Applied Catalysis A General · 92
The importance of passivation in the study of iron Fischer-Tropsch catalysts
1996 · Mehul D. Shroff, Abhaya K. Datye · Catalysis Letters · 74
Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method
2018 · Chase Cook, Zeyu Sun, et al. · IEEE Transactions on Very Large Scale Integration (VLSI) Systems · 57
Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires
2018 · Zeyu Sun, Ertugrul Demircan, et al. · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 40
Voltage-based electromigration immortality check for general multi-branch interconnects
2016 · Zeyu Sun, Ertugrul Demircan, et al. · 36
1-D and 2-D Geometry Effects in Uniaxially-Strained Dual Etch Stop Layer Stressor Integrations
2006 · P. Grudowski, V. Adams, et al. · Symposium on VLSI Technology · 27
Realistic Projections of Product Fails from NBTI and TDDB
2006 · A. Haggag, M. Moosa, et al. · IEEE International Reliability Physics Symposium proceedings · 26
Terrestrial SER characterization for nanoscale technologies: A comparative study
2015 · N. N. Mahatme, B. Bhuva, et al. · IEEE International Reliability Physics Symposium proceedings · 17
Model based method for electro-migration stress determination in interconnects
2014 · Ertugrul Demircan, Mehul Shroff · IEEE International Reliability Physics Symposium proceedings · 16
Data analytics and machine learning: root-cause problem-solving approach to prevent yield loss and quality issues in semiconductor industry for automotive applications
2021 · Corinne Berges, Jim Bird, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 13
A novel biasing technique for addressable parametric arrays
2008 · Brad Smith, Uma Annamalai, et al. · IEEE International Conference on Microelectronic Test Structures (ICMTS) · 8
Nanoscale attrition during activation of precipitated iron Fischer-Tropsch catalysts: Implications for catalyst design
1996 · A.K. Datye, M.D. Shroff, et al. · Studies in surface science and catalysis · 8
A Novel Biasing Technique for Addressable Parametric Arrays
2009 · Brad Smith, Alexandre Arriordaz, et al. · IEEE Transactions on Semiconductor Manufacturing · 7
The role of catalyst activation on the activity and attrition of precipitated iron Fischer-Tropsch catalysts
1997 · Abhaya K. Datye, Mehul D. Shroff, et al. · Studies in surface science and catalysis · 7
Nanoscale attrition during activation of precipitated iron Fischer- Tropsch catalysts: Implications for catalyst design
1996 · Sandia National Labs., Albuquerque, NM (United States), A Datye, et al. · OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) · 7
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The role of catalyst activation on the activity and attrition of precipitated iron Fischer-Tropsch catalysts
1995 · Sandia National Labs., Albuquerque, NM (United States), A Datye, et al. · OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) · 6
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Design-technology co-optimization for reliability and quality in advanced nodes
2021 · Mehul D. Shroff, Alvin L. Loke · SPIE Design-Process-Technology Co-optimization · 5
Full-chip wire-oriented back-end-of-line TDDB hotspot detection and lifetime analysis
2019 · Shaoyi Peng, Ertugrul Demircan, et al. · Integration · 5
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Activation of Precipitated Iron Fischer-Tropsch Catalysts
1995 · Mehul D. Shroff · UNM’s Digital Repository (University of New Mexico) · 4
An efficient methodology to evaluate BEOL and MOL TDDB in advanced nodes
2021 · S. Jose, C. Yin, et al. · IEEE International Reliability Physics Symposium proceedings · 3
Inspection methodologies and machine-learning approaches for defectivity data in semiconductor industry for automotive applications: case study for field-failure prevention
2022 · Corinne Berges, Jim Bird, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 2
Carbide formation during activation of iron Fisher-Tropsch catalysts
1996 · M. D. Shroff, D. S. Kalakkad, et al. · Springer eBooks · 2
Application-based Modeling of I/O Reliability
2025 · M. D. Shroff, J. Satasia, et al. · IEEE International Reliability Physics Symposium proceedings · 1
A Fast, Statistical, Machine-learning Approach for Automotive Semiconductor Test Reduction
2024 · Mehul D. Shroff, Nguyen Nguyen, et al. · IEEE International Test Conference (ITC) · 1
Works count: 34
Citation count: 811
H-index: 11
I10-index: 11
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