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Author

Mohammed S. Gumaan

Observed name: Gumaan, Mohammed S.
ORCID: 0000-0001-7984-5206
Observed ORCID: 0000-0001-7984-5206
OpenAlex ID: A5037177644
Microstructural and mechanical characterization of melt spun process Sn-3.5Ag and Sn-3.5Ag-xCu lead-free solders for low cost electronic assembly
2017 · Rizk Mostafa Shalaby, Mustafa Kamal, et al. · Materials Science and Engineering A · 51
Design and Properties of New Lead-Free Solder Joints Using Sn-3.5Ag-Cu Solder
2018 · Rizk Mostafa Shalaby, Mustafa Kamal, et al. · Silicon · 45
Copper effects in mechanical, thermal and electrical properties of rapidly solidified eutectic Sn–Ag alloy
2018 · Mohammed S. Gumaan, Rizk Mostafa Shalaby, et al. · Journal of Materials Science Materials in Electronics · 35
Nickel effects on the structural and some physical properties of the eutectic Sn-Ag lead-free solder alloy
2019 · Mohammed S. Gumaan, Rizk Mostafa Shalaby, et al. · Soldering and Surface Mount Technology · 34
Structural, Optical, Thermal, Morphological and Electrical Studies of PEMA/PMMA Blend Filled with CoCl2 and LiBr As Mixed Filler
2020 · E. M. Abdelrazek, G. M. Asnag, et al. · Journal of Electronic Materials · 33
Effect of TiO2 nanoparticles on the microstructure, mechanical and thermal properties of rapid quenching SAC355 lead-free solder alloy
2022 · Hamed Al-sorory, Mohammed S. Gumaan, et al. · Soldering and Surface Mount Technology · 26
Chromium improvements on the mechanical performance of a rapidly solidified eutectic Sn–Ag alloy
2020 · Mohammed S. Gumaan · Journal of Materials Science Materials in Electronics · 24
Effect of Al2O3 Nanoparticle Addition on the Microstructure, Mechanical, Thermal, and Electrical Properties of Melt-Spun SAC355 Lead-Free Solder for Electronic Packaging
2022 · Hamed Al-sorory, Mohammed S. Gumaan, et al. · Journal of Materials Engineering and Performance · 14
Microstructural and creep characterization of Sn-0.7Cu and Sn-0.7Cu-xBi lead-free solders for low cost electronic
2022 · Shakib Alsowidy, Ahmed M. Aljarbani, et al. · Results in Materials · 14
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Reliable Sn–Ag–Cu lead-free melt-spun material required for high-performance applications
2019 · Mohammed Mundher Jubair, Mohammed S. Gumaan, et al. · Zeitschrift für Kristallographie - Crystalline Materials · 14
A note on Topological indices and coindices of disjunction and symmetric difference of graphs
2021 · Abdu Alameri, Mohammed Alsharafi, et al. · Discrete Applied Mathematics · 11
Chromium effects on the microstructural, mechanical and thermal properties of a rapidly solidified eutectic Sn-Ag alloy
2019 · Sanaa Razzaq Abbas, Mohammed S. Gumaan, et al. · Soldering and Surface Mount Technology · 10
The second Hyper-Zagreb index of graph operations
2021 · Modabish, Abdelhafid, Alameri, Abdu, et al. · Journal of Mathematical and Computational Science · 8
ZnO nanoparticles and compositional dependence of structural, thermal, mechanical and electrical properties of eutectic SAC355 lead-free solder
2022 · Hamed Al-sorory, Mohammed S. Gumaan, et al. · Soldering and Surface Mount Technology · 7
Effects of Sb and/or Sn concentrations on the SbSn formation in a ternary melt-spun Pb–Sb–Sn alloy
2022 · E.A. Ali, Mohammed Majeed Hameed, et al. · Results in Materials · 5
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ZnO nanoparticles and compositional dependence of structural, thermal, mechanical, and electrical properties for eutectic SAC355 lead-free solder alloys
2022 · Hamed Al-sorory, Mohammed S. Gumaan, et al. · Results in Materials · 5
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Improvement of the Mechanical Properties of Sn-Ag-Sb Lead-Free Solders: Effects of Sb addition and rapidly solidified
2016 · Mohammed S. Gumaan, Esmail Abdo Mohammed Ali, et al. · University of Science and Technology Institutional Repository (University of Science and Technology, Sana’a, Yemen) · 4
Effect of CuAl2 on the Microstructure and Hardness of Al-Si-xCu Alloys Produced by Powder Metallurgy
2023 · Shakib Alsowidy, Olfat Humaid, et al. · مجلة جامعة صنعاء للعلوم التطبيقية والتكنولوجيا · 2
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The Inner Universe Theory of Dark Energy Interpretation
2021 · Wahib AL-Arashi, Mohammed S. Gumaan, et al. · University of Science and Technology Institutional Repository (University of Science and Technology, Sana’a, Yemen) · 2
Microstructural and Creep Characterization of Sn-0.7Cu and Sn-0.7Cu-xBi Lead-free Solders for Low Cost Electronic Applications
2021 · Shakib Alsowidy, Ahmed M. Aljarbani, et al. · Research Square · 2
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Bismuth Improvements on the Mechanical Performance of an As-Cast Eutectic Sn-Cu Alloy
2024 · Mohammed S. Gumaan · University of Science and Technology Journal for Engineering and Technology
Microstructure and Localized Plastic Deformation of Al/Si Alloy Improved with CuAl2 Compound
2023 · Humaid, Olfat, Humaid, Abdulrahman A., et al. · PSM Biological Research
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The second Hyper-Zagreb index of graph operations
2021 · Abdelhafid Modabish, Abdu Alameri, et al. · J. Math. Comput. Sci.
A Study of Monotectic Al-Bi Alloys Rapidly Solidified from Melt
2020 · Abbas, Sanaa Razzaq, Gumaan, Mohammed S. · University of Science and Technology Institutional Repository (University of Science and Technology, Sana’a, Yemen)
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Effect of adding Al to the Pb-Ca based alloys rapidly quenched and study the electrical, mechanical and thermal properties.
2020 · Abbas, Sanaa Razzaq, Gumaan, Mohammed S., et al. · University of Science and Technology Institutional Repository (University of Science and Technology, Sana’a, Yemen)
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Works count: 26
Citation count: 344
H-index: 11
I10-index: 12
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