Author

Ringo Koepge

Observed names: Koepge, R., Koepge, Ringo, R Koepge, R. Koepge

Institutions: Fraunhofer Institute for Microstructure of Materials and Systems, Fraunhofer Center for Silicon Photovoltaics

Observed institutions: Argonne National Laboratory, Lawrence Berkeley National Laboratory, University of Konstanz, Fraunhofer Institute for Mechanics of Materials, Fraunhofer Institute for Microstructure of Materials and Systems, Fraunhofer Center for Silicon Photovoltaics, Advanced Light Source, Advanced Photon Source, Massachusetts Institute of Technology

ORCID: 0000-0003-0808-6796

Observed ORCID: 0000-0003-0808-6796

OpenAlex ID: A5037185030

Infrared birefringence imaging of residual stress and bulk defects in multicrystalline silicon

2010 · Vidya Ganapati, Stephan Schoenfelder, et al. · Journal of Applied Physics · 65

Loss of wire tension in the wire web during the slurry based multi wire sawing process

2013 · Daniel Meißner, Stephan Schoenfelder, et al. · Solar Energy Materials and Solar Cells · 35

The Influence of Transport Operations on the Wafer Strength and Breakage Rate

2011 · Koepge, R., Schoenfelder, S., et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 12

Design, manufacturing, and performance of innovative aluminium-backed BIPV facade modules: a case-study in Germany

2025 · S. Jahreis, B. Jaeckel, et al. · Energy and Buildings · 10

Damage and Breakage of Silicon Wafers during Impact Loading on the Wafer Edge

2012 · Kaule, F., Koepge, R., et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 5

Quantitative Stress Measurements of Bulk Microdefects in Multicrystalline Silicon

2009 · Schoenfelder, S., Sampson, A., et al. · EU PVSEC · 5

Variation of Silicon Wafer Strength and Edge Chipping Induced by Residual Stresses at the Brick Bonding Interface

2019 · Koepge, R., Buehler, K., et al. · EU PVSEC · 4

Material screening for the development of a photovoltaic module using biodegradable materials from renewable raw materials

2025 · Matthias Pander, Ringo Koepge, et al. · EPJ Photovoltaics · 3

Analysis of structured wire wafering processes to predict optimized process settings by varying particle size and wire diameter

2018 · Ringo Koepge, Kjell Buehler, et al. · AIP conference proceedings · 2

Silicon Photovoltaics on Metal Substrates: Investigating Cell Gap Changes in Modules With Aluminum Rear Cover

2026 · Wiebke Wirtz, Kevin Meyer, et al. · Solar RRL · 1

Sustainable Solar Module Through the Substitution of Materials by Renewable Encapsulation, Recycled Backsheet, and Lead‐Free Interconnection

2024 · R. Koepge, M. Pander, et al. · Progress in Photovoltaics Research and Applications · 1

Advanced Analysis of Multi Wire Wafering Processes

2017 · Ringo Koepge, Samuel Brinnig, et al. · Conference record of the IEEE Photovoltaic Specialists Conference · 1

Development of an approach to wafer production in an industry 4.0 environment

2022 · Felix Neduck, Ringo Koepge · AIP conference proceedings

Advanced Analysis of Multi Wire Sawing Processes and Wire Performance Detection

2017 · Stephan Schoenfelder, Hartmut Schwabe, et al. · European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC)

Crack Distribution and Strength of Silicon Wafers Considering the Crystallographic Orientation of the Silicon Ingot in Diamond Wire Sawing Process

2016 · Klute, C., Koepge, R., et al. · EU PVSEC

Mechanical and Microstructural Analysis of Diamond Wire Sawn Wafers Considering the Wire Wear in Sawing Process

2015 · Stephan Schoenfelder, O. Anspach, et al. · European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC)

Works count: 26

Citation count: 145

H-index: 5

I10-index: 4