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Kyungsu Kang
Observed name:
Kyung-Su Kang
Institution:
Sahmyook University
Observed institutions:
Korea Advanced Institute of Science and Technology,
Changwon National University,
Samsung (South Korea),
Sahmyook University,
Samsung Electronics (South Korea),
École Polytechnique Fédérale de Lausanne
show all 6
ORCID:
0000-0002-6955-578X
Observed ORCID:
0000-0002-6955-578X
OpenAlex ID:
A5037212268
Predicting types of occupational accidents at construction sites in Korea using random forest model
2019
·
Kyungsu Kang
, Hanguk Ryu
·
Safety Science
·
248
Deep learning-based framework for monitoring wearing personal protective equipment on construction sites
2023
·
Yeo-Reum Lee
, Seung-Hwan Jung
, et al.
·
Journal of Computational Design and Engineering
·
52
PDF
Runtime Power Management of 3-D Multi-Core Architectures Under Peak Power and Temperature Constraints
2011
·
Kyungsu Kang
, Jungsoo Kim
, et al.
·
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
·
31
Accelerating RocksDB for small-zone ZNS SSDs by parallel I/O mechanism
2022
·
Minwoo Im
, Kyungsu Kang
, et al.
·
International Middleware Conference
·
27
Temperature-Aware Integrated DVFS and Power Gating for Executing Tasks With Runtime Distribution
2010
·
Kyungsu Kang
, Jungsoo Kim
, et al.
·
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
·
24
Runtime Thermal Management for 3-D Chip-Multiprocessors With Hybrid SRAM/MRAM L2 Cache
2014
·
Seunghan Lee
, Kyungsu Kang
, et al.
·
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
·
19
REDELF: An Energy-Efficient Deadlock-Free Routing for 3D NoCs with Partial Vertical Connections
2015
·
Jinho Lee
, Kyungsu Kang
, et al.
·
ACM Journal on Emerging Technologies in Computing Systems
·
14
Design and management of 3D-stacked NUCA cache for chip multiprocessors
2011
·
Jongpil Jung
, Kyungsu Kang
, et al.
·
ACM Great Lakes Symposium on VLSI (GLSVLSI)
·
14
Thermal-aware energy minimization of 3D-stacked L3 cache with error rate limitation
2011
·
Woojin Yun
, Kyungsu Kang
, et al.
·
IEEE International Symposium on Circuits and Systems proceedings
·
12
A high-throughput and low-latency interconnection network for multi-core Clusters with 3-D stacked L2 tightly-coupled data memory
2012
·
Kyungsu Kang
, Luca Benini
, et al.
·
IEEE/IFIP International Conference on VLSI and System-on-Chip (VLSI-SoC)
·
11
PDF
Temperature-aware runtime power management for chip-multiprocessors with 3-D stacked cache
2014
·
Kyungsu Kang
, Giovanni De Micheli
, et al.
·
International Symposium on Quality Electronic Design (ISQED)
·
10
PDF
Seamless SoC Verification Using Virtual Platforms: An Industrial Case Study
2019
·
Kyungsu Kang
, Sangho Park
, et al.
·
Design, Automation, and Test in Europe
·
8
THOR: Orchestrated thermal management of cores and networks in 3D many-core architectures
2015
·
Jinho Lee
, Junwhan Ahn
, et al.
·
Asia and South Pacific Design Automation Conference (ASP-DAC)
·
8
Maximizing throughput of temperature-constrained multi-core systems with 3D-stacked cache memory
2011
·
Kyungsu Kang
, Jongpil Jung
, et al.
·
International Symposium on Quality Electronic Design (ISQED)
·
8
Temperature-aware energy minimization of 3D-stacked L2 DRAM cache through DVFS
2012
·
Woojin Yun
, Jongpil Jung
, et al.
·
International SoC Design Conference
·
7
Search Area Selective Reuse Algorithm in Motion Estimation
2007
·
Heejun Shim
, Kyungsu Kang
, et al.
·
IEEE International Conference on Multimedia and Expo (ICME)
·
6
Cost-Effective Design of Mesh-of-Tree Interconnect for Multicore Clusters With 3-D Stacked L2 Scratchpad Memory
2014
·
Kyungsu Kang
, Luca Benini
, et al.
·
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
·
5
Hybrid L2 NUCA Design and Management Considering Data Access Latency, Energy Efficiency, and Storage Lifetime
2016
·
Seunghan Lee
, Kyungsu Kang
, et al.
·
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
·
4
Early HW/SW Co-Verification Using Virtual Platforms
2021
·
Jungyun Choi
, Kyungsu Kang
, et al.
·
International SoC Design Conference
·
3
A Power-Efficient 3-D On-Chip Interconnect for Multi-Core Accelerators with Stacked L2 Cache
2016
·
Kyungsu Kang
, Sangho Park
, et al.
·
Design, Automation, and Test in Europe
·
3
PDF
Runtime 3-D stacked cache data management for energy minimization of 3-D chip-multiprocessors
2014
·
Seunghan Lee
, Kyungsu Kang
, et al.
·
International Symposium on Quality Electronic Design (ISQED)
·
3
Fast estimation of software energy consumption using IPI(Inter-Prefetch Interval) energy model
2007
·
Jungsoo Kim
, Kyungsu Kang
, et al.
·
IFIP International Conference on Very Large Scale Integration (VLSI-SoC)
·
3
Cost-effective TSV redundancy configuration
2012
·
Jongpil Jung
, Kyungsu Kang
, et al.
·
IEEE/IFIP International Conference on VLSI and System-on-Chip (VLSI-SoC)
·
2
Squeezing maximizing performance out of 3D cache-stacked multicore architectures
2011
·
Asim Khan
, Kyungsu Kang
, et al.
·
IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)
·
2
Energy minimization of 3D cache-stacked processor based on thin-film thermoelectric coolers
2011
·
Soojung Rho
, Kyungsu Kang
, et al.
·
IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)
·
2
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Works count:
37
Citation count:
535
H-index:
10
I10-index:
11
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