Author

Chun-Pei Chen

Institution: National Central University

Observed institutions: National Yang Ming Chiao Tung University, National Taiwan University, Purdue University West Lafayette, National Central University

ORCID: 0000-0003-4156-0787

Observed ORCID: 0000-0003-4156-0787

OpenAlex ID: A5037825378

Image-Text Co-Decomposition for Text-Supervised Semantic Segmentation

2024 · Ji-Jia Wu, Andy Chia-Hao Chang, et al. · IEEE Computer Society Conference on Computer Vision and Pattern Recognition/Proceedings - IEEE Computer Society Conference on Computer Vision and Pattern Recognition/Proceedings · 15

PDF

Singular enrichment for multi-material corners with application to assessing the risk of fracture in semiconductor devices

2021 · Chun-Pei Chen, Yaxiong Chen, et al. · Engineering Fracture Mechanics · 9

New clinical failure mode triggered by a new coronary stent design

2014 · Hao-Ming Hsiao, Chun-Ting Yeh, et al. · Bio-Medical Materials and Engineering · 9

A Mechanistic Model for Plastic Metal Line Ratcheting Induced BEOL Cracks in Molded Packages

2022 · Chun-Pei Chen, Yaxiong Chen, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 6

A Mechanistic Model for Plastic Metal Line Ratcheting Induced BEOL Cracks in Molded Packages

2020 · Chun-Pei Chen, Yaxiong Chen, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 5

Topology optimization for efficient heat removal in 3D packages

2016 · Chun-Pei Chen, Yifan Weng, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 4

Parametric stitching for smooth coupling of subdomains with non-matching discretizations

2020 · Chun-Pei Chen, Yaxiong Chen, et al. · Computer Methods in Applied Mechanics and Engineering · 3

Estimating the Modulus and Yield Strength of the Top-Layer Film on Multilayer BEOL Stacks

2018 · Tao Song, Chun-Pei Chen, et al. · IEEE Transactions on Device and Materials Reliability · 3

Conservation laws for arbitrary objectives with application to fracture resistant design

2022 · Chung-Shuo Lee, Chun-Pei Chen, et al. · International Journal of Fracture · 1

Estimating the yield strength of metal films in ILD stacks using optimization-based inverse finite element analysis

2017 · Chun-Pei Chen, Ganesh Subbarayan, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 1

Simulation study of a split-gate superjunction SiC MOSFET with a p-type shielding layer

2026 · Jun-Sheng Huang, Xin-Yi Luo, et al. · Japanese Journal of Applied Physics

PDF

Thermal Design of Three-Dimensional Electronic Assemblies

2015 · Yifan Weng, Chun-Pei Chen, et al. · Purdue e-Pubs (Purdue University System)

PDF

Works count: 12

Citation count: 56

H-index: 5

I10-index: 1