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Author

Masanori Muroyama

Observed names: M Muroyama, M. Muroyama, MUROYAMA, Masanori, Muroyama, Masanori
Observed institutions: Tohoku Institute of Technology, Kyushu University, Tohoku University, Organization for Advanced Studies, Tohoku University, Advanced Institute for Materials Research, Tohoku University, System LSI Research Center, Kyushu University, Micro System Integration Center, Tohoku University
ORCID: 0000-0002-6808-5106
Observed ORCID: 0000-0002-6808-5106
OpenAlex ID: A5037940534
3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer
2017 · Sho Asano, Masanori Muroyama, et al. · Sensors · 36
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Advanced LSI-based amperometric sensor array with light-shielding structure for effective removal of photocurrent and mode selectable function for individual operation of 400 electrodes
2014 · Kumi Y. Inoue, Masahki Matsudaira, et al. · Lab on a Chip · 35
Integration and packaging technology of MEMS-on-CMOS capacitive tactile sensor for robot application using thick BCB isolation layer and backside-grooved electrical connection
2012 · M. Makihata, S. Tanaka, et al. · Sensors and Actuators A Physical · 33
Integrated 3-axis tactile sensor using quad-seesaw-electrode structure on platform LSI with through silicon vias
2018 · Yoshiyuki Hata, Yukio Suzuki, et al. · Sensors and Actuators A Physical · 32
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Design and Fabrication Technology of Low Profile Tactile Sensor with Digital Interface for Whole Body Robot Skin
2018 · Mitsutoshi Makihata, Masanori Muroyama, et al. · Sensors · 25
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A Tactile Sensor Network System Using a Multiple Sensor Platform with a Dedicated CMOS-LSI for Robot Applications
2017 · Chenzhong Shao, Shuji Tanaka, et al. · Sensors · 24
Delay window blind oversampling clock and data recovery algorithm with wide tracking range
2015 · Travis Bartley, Shuji Tanaka, et al. · IEEE International Symposium on Circuits and Systems proceedings · 22
Surface-mountable capacitive tactile sensors with flipped CMOS-diaphragm on a flexible and stretchable bus line
2016 · Sho Asano, Masanori Muroyama, et al. · Sensors and Actuators A Physical · 21
Adhesive wafer bonding using a molded thick benzocyclobutene layer for wafer-level integration of MEMS and LSI
2011 · M Makihata, S Tanaka, et al. · Journal of Micromechanics and Microengineering · 20
A Simulation-Based Soft Error Estimation Methodology for Computer Systems
2006 · M. Sugihara, T. Ishihara, et al. · International Symposium on Quality Electronic Design (ISQED) · 20
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A 1.7mm3 MEMS-on-CMOS tactile sensor using human-inspired autonomous common bus communication
2013 · M. Makihata, M. Muroyama, et al. · International Conference on Solid-State Sensors, Actuators and Microsystems · 18
AMPLE: An Adaptive Multi-Performance Processor for Low-Energy Embedded Applications
2008 · Tohru Ishihara, Seiichiro Yamaguchi, et al. · 17
CMOS-on-LTCC integrated fingertip sensor with 3-axis tactile and thermal sensation for robots
2017 · Sho Asano, Masanori Muroyama, et al. · International Conference on Solid-State Sensors, Actuators and Microsystems · 16
Quad-seesaw-electrode type 3-axis tactile sensor with low nonlinearities and low cross-axis sensitivities
2017 · Yoshiyuki Hata, Yutaka Nonomura, et al. · Sensors and Actuators A Physical · 15
Tactile Sensing Using Magnetic Foam
2022 · Gildas Diguet, Joerg Froemel, et al. · Polymers · 13
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300 μm Deep through silicon via in laser-ablated CMOS multi-project wafer for cost-effective development of integrated MEMS
2017 · Yukio Suzuki, Hideyuki Fukushi, et al. · IEEE International Conference on Micro Electro Mechanical Systems (MEMS) · 13
3-Axis fully-integrated surface-mountable differential capacitive tactile sensor by CMOS flip-bonding
2016 · Sho Asano, Masanori Muroyama, et al. · IEEE International Conference on Micro Electro Mechanical Systems (MEMS) · 13
A CMOS-LSI for a sensor network platform of social robot applications
2016 · Masanori Muroyama, Travis Bartley, et al. · 12
An SOI tactile sensor with a quad seesaw electrode for 3-axis complete differential detection
2014 · Y. Hata, Y. Nonomura, et al. · IEEE International Conference on Micro Electro Mechanical Systems (MEMS) · 12
Development of an LSI for Tactile Sensor Systems on the Whole-Body of Robots
2011 · Masanori Muroyama, Mitsutoshi Makihata, et al. · IEEJ Transactions on Sensors and Micromachines · 11
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An Energy Characterization Framework for Software-Based Embedded Systems
2006 · Donghoon Lee, Tohru Ishihara, et al. · IEEE/ACM/IFIP Workshop on Embedded Systems for Real-Time Multimedia (ESTIMedia) · 11
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Reducing access energy of on-chip data memory considering active data bitwidth
2002 · T. Okuma, Y. Cao, et al. · International Symposium on Low Power Electronics and Design (ISLPED) · 11
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Multi-sensor platform LSI enabling different sensors to be event-driven and connected to common differental bus line
2017 · Masanori Muroyama, Takahiro Nakayama, et al. · International Conference on Solid-State Sensors, Actuators and Microsystems · 10
Event-Driven Tactile Sensing System Including 100 CMOS-MEMS Integrated 3-Axis Force Sensors Based on Asynchronous Serial Bus Communication
2020 · Chenzhong Shao, Hideki Hirano, et al. · IEEE Sensors Journal · 9
Development of a Real-Time Force and Temperature Sensing System with MEMS-LSI Integrated Tactile Sensors for Next-Generation Robots
2020 · Masanori Muroyama, Hideki Hirano, et al. · Journal of Robotics and Mechatronics · 9
Works count: 107
Citation count: 631
H-index: 14
I10-index: 23
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