Author

John Coonrod

Observed name: Coonrod, John

Institution: Rogers (United States)

Observed institution: Rogers (United States)

ORCID: 0009-0003-0621-056X

Observed ORCID: 0009-0003-0621-056X

OpenAlex ID: A5038428360

Ambiguous Influences Affecting Insertion Loss of Microwave Printed Circuit Boards [Application Notes]

2012 · John Coonrod · IEEE Microwave Magazine · 27

Understanding the variables of dielectric constant for PCB materials used at microwave frequencies

2011 · John Coonrod · European Microwave Conference (EuMC) · 15

The influence of test method, conductor profile and substrate anisotropy on the permittivity values required for accurate modeling of high frequency planar circuits

2012 · Allen F. Horn, Patricia A. LaFrance, et al. · Circuit World · 8

Theory vs. Reality: Using Printed Circuit Board Technology for Grounded Coplanar Waveguide at Millimeter-Wave Frequencies: Understanding PCB Technology for Millimeter-Wave Applications

2024 · John Coonrod · IEEE Microwave Magazine · 4

High Frequency Circuit Materials With Increased Thermal Conductivity

2010 · John Coonrod, Allen F. Horn · 4

Choosing Microwave PCB Materials for Wireless Communications Components

2014 · John Coonrod, Rogers Corp · 3

An Efficient EM Simulation Model for ENIG Plated Metal Finishes Including Conductor Side-Wall Plating Verified With Physical Measurement from 1 to 50 GHz

2018 · Brian Rautio, John Coonrod · IEEE MTT-S International Microwave Workshop Series on 5G Hardware and System Technologies (IMWS-5G) · 2

Applied methodology for harmonic suppression of microstrip edge coupled bandpass filters using composite circuit materials

2015 · John Coonrod · European Microwave Conference (EuMC) · 2

Measurement of simulated active device and RF trace heating in high frequency circuit laminates

2011 · Christopher J. Caisse, John Coonrod, et al. · Circuit World · 2

Round-Robin of High-Frequency Test Methods by IPC-D24C Task Group

2016 · Glenn Oliver, Jonathan Weldon, et al. · Journal of Microelectronics and Electronic Packaging · 1

Domestic Build-Up Film Advancing Fan-Out Wafer-Level Packaging (FOWLP) Through the SHIELD USA Program

2026 · Nazeef Azam, Tanya Singh-Rachford, et al. · IMAPSource Proceedings

High-Performance PCB Materials for Next-Generation Electronics Packages, driving Signal Integrity, Power Handling, and Reliability

2025 · John Coonrod, Lance Blaskowski, et al. · IMAPSource Proceedings

Works count: 19

Citation count: 68

H-index: 4

I10-index: 2