Author

Alexander Janta-Polczynski

Observed name: Janta-Polczynski Alexander

Institution: IBM (Canada)

Observed institution: IBM (Canada)

ORCID: 0000-0001-9792-1495

Observed ORCID: 0000-0001-9792-1495

OpenAlex ID: A5038712625

A Novel Approach to Photonic Packaging Leveraging Existing High-Throughput Microelectronic Facilities

2016 · Tymon Barwicz, Yoichi Taira, et al. · IEEE Journal of Selected Topics in Quantum Electronics · 96

Automated, high-throughput photonic packaging

2018 · Tymon Barwicz, Ted W. Lichoulas, et al. · Optical Fiber Technology · 67

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Integrated Metamaterial Interfaces for Self-Aligned Fiber-to-Chip Coupling in Volume Manufacturing

2018 · Tymon Barwicz, Bo Peng, et al. · IEEE Journal of Selected Topics in Quantum Electronics · 66

An O-band Metamaterial Converter Interfacing Standard Optical Fibers to Silicon Nanophotonic Waveguides

2015 · Tymon Barwicz, Alexander Janta-Polczynski, et al. · Optical Fiber Communication Conference · 66

Automated, self-aligned assembly of 12 fibers per nanophotonic chip with standard microelectronics assembly tooling

2015 · Tymon Barwicz, Nicolas Boyer, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 31

Advances in Interfacing Optical Fibers to Nanophotonic Waveguides Via Mechanically Compliant Polymer Waveguides

2020 · Tymon Barwicz, Alexander Janta-Polczynski, et al. · IEEE Journal of Selected Topics in Quantum Electronics · 25

Optical Demonstration of a Compliant Polymer Interface between Standard Fibers and Nanophotonic Waveguides

2015 · Tymon Barwicz, Yoichi Taira, et al. · Optical Fiber Communication Conference · 21

A Metamaterial Converter Centered at 1490nm for Interfacing Standard Fibers to Nanophotonic Waveguides

2016 · Tymon Barwicz, Nicolas Boyer, et al. · Optical Fiber Communication Conference · 20

Novel, High-Throughput, Fiber-to-Chip Assembly Employing Only Off-the-Shelf Components

2017 · Nicolas Boyer, Alexander Janta-Polczynski, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 19

Solder-Reflowable, High-Throughput Fiber Assembly Achieved by Partitioning of Adhesive Functions

2018 · Alexander Janta-Polczynski, Elaine Cyr, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 15

Optical fiber pigtails integration in co-package

2022 · Alexander Janta-Polczynski, Martin Robitaille · IEEE Electronic Components and Technology Conference (ECTC) · 14

Enabling large-scale deployment of photonics through cost-efficient and scalable packaging

2015 · Tymon Barwicz, Yoichi Taira, et al. · IEEE International Conference on Group IV Photonics (GFP) · 12

A compliant polymer interface with 1.4dB loss between standard fibers and nanophotonic waveguides

2016 · Tymon Barwicz, Alexander Janta-Polczynski, et al. · Frontiers in Optics · 11

Sub-Micron Bondline-Shape Control in Automated Assembly of Photonic Devices

2016 · Nicolas Boyer, Alexander Janta-Polczynski, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 10

Photonic Packaging in High-Throughput Microelectronic Assembly Lines for Cost-Efficiency and Scalability

2015 · Tymon Barwicz, Yoichi Taira, et al. · Optical Fiber Communication Conference · 10

Solder-reflowable single-mode fiber array photonics assembly in high-throughput manufacturing facilities

2019 · Alexander Janta-Polczynski, Elaine Cyr, et al. · Optical Interconnects and Packaging · 7

Towards co-packaging of photonics and microelectronics in existing manufacturing facilities

2018 · Shotaro Takenobu, Yoichi Taira, et al. · 6

High-Throughput Photonic Packaging

2017 · Tymon Barwicz, Ted W. Lichoulas, et al. · Optical Fiber Communication Conference · 6

Integrated Connector for Silicon Photonic Co-package Optics with Strain Relief Accommodation Through Fiber Bending

2021 · Alexander Janta-Polczynski, Martin Robitaille · IEEE Electronic Components and Technology Conference (ECTC) · 4

Breaking the mold of photonic packaging

2018 · Tymon Barwicz, Ted Lichoulas, et al. · Integrated Optics: Devices, Materials, and Technologies · 4

Compliant Polymer Interface Demonstration with Standard Plug-In Connection to Fiber Cables

2018 · Tymon Barwicz, Kengo Watanabe, et al. · IEEE Photonics Conference · 3

Automated Assembly of Duplex Fiber Connectors to Photonic Chips in Standard Microelectronic Tools

2018 · Ted W. Lichoulas, Eddie L. Kimbrell, et al. · Conference on Lasers and Electro-Optics · 3

Packaging challenges for next-generation high bandwidth opto-electrical switch modules

2020 · Alexander Janta-Polczynski, Elaine Cyr, et al. · 2

Laser Attach Process Development and Material Selection

2024 · Alexander Janta-Polczynski, Elaine Cyr, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 1

Experimental Identification of the Failure Modes and Failure Mechanisms of Fiber to Waveguide Couplings Under Cyclic Tensile Loading

2023 · Dione Assane, Morissette Jean-François, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 1

Works count: 29

Citation count: 523

H-index: 12

I10-index: 15